Display to semiconductor: Panel makers weaponize large glass substrates for FOPLP

DIGITIMES observes that advances in AI chip technology, coupled with larger chip sizes and the growing adoption of heterogeneous integration packaging, are driving up package dimensions. This is prompting semiconductor companies to accelerate the shift from fan-out wafer-level packaging (FOWLP) to fan-out panel-level packaging (FOPLP), leveraging a "square instead of round" approach to improve production efficiency.

Because display makers already operate production lines with glass substrates larger than those used by conventional packaging and testing houses, they are considered better positioned to develop FOPLP technology. At present, Innolux is the only panel maker independently developing an FOPLP business using its legacy TFT-LCD production lines.

The company recently showcased an RDL-first sample featuring 10 redistribution layers (RDLs), demonstrating early progress in addressing glass substrate warpage issues, and is targeting mass production of the related technology within the next one to two years. Meanwhile, AUO has opted to temporarily avoid direct competition with packaging and testing houses, instead focusing on RDL-related applications such as satellite antennas and optical communications to strengthen its technical capabilities. For its part, Sharp has moved to sell a plant to Japan's packaging and testing player AOI Electronics, providing the necessary technical support to help develop its FOPLP business.