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Taiwan notebook industry, 1Q 2026: 1Q26 beats expectations, but US-Iran war clouds 2Q26 outlook
Affected by the US-Iran war and notebook price hikes, global notebook shipments are likely to increase only 4.4% quarterly in the second quarter of 2026.
Henry Chang
Thursday 7 May 2026
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Global server market, 1Q 2026: Agentic AI sparks general-purpose server revival
Agentic AI drives general server demand; global server shipments to top five million units in the second quarter of 2026.
Jim Hsiao
Monday 4 May 2026
report
China high-end AI accelerator market 2026: Localization trends, competitive landscape, and supply chain constraints
Government policies drive China's chip autonomy; 2026 Chinese cloud AI accelerator shipments to top 2.12 million units, with Huawei taking over 50%.
Stella Weng
Tuesday 28 April 2026
report
What Nvidia and Broadcom's CPO bets reveal about the future of AI infrastructure
report
Taiwan IPC players shift to edge AI solutions: Growth opportunities and supply chain challenges in 2026
Large Taiwanese IPC players begin reaping early edge AI deployment dividends in 2025, with estimated 2026 revenue growth of 12%.
Zouhao Shen
Monday 27 April 2026
report
Financial outlook for top 4 CSPs: accelerating cloud revenues and record capex in 2026
Cloud business revenue enters a critical moment of accelerated growth; the top-4 CSPs revise their 2026 capex upwards to US$660 billion.
Aaron Chen
Thursday 23 April 2026
report
Global wafer foundry industry and status, 2026: AI-driven growth and fierce competition
Global wafer foundry revenue in 2026 is estimated to grow 23.5% year-over-year, expected to reach US$250 billion.
Eric Chen
Monday 20 April 2026
report
Accelerating enterprise AI: Hardware advancements and compute architecture transformation
According to DIGITIMES, six major AI applications - chatbots, software development, image generation, video generation, enterprise operations automation, and manufacturing process automation - are increasingly being adopted by enterprises. The resulting surge in inference demand, combined with diverse deployment models across cloud, edge, and on-premises environments, is driving a significant “specification reset” in AI infrastructure.
Jim Hsiao
Friday 17 April 2026
report
Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond
Major OSAT providers accelerate 2.5D/3D advanced packaging deployments in US, Japan, South Korea, and Malaysia with non-Taiwan capacity footprint to expand.
Staff writer
Thursday 16 April 2026
report
Beyond Huawei: China's New H3C Leverages Former HP Roots to Dominate ASEAN Server Markets
Chinese top-3 server exporter, the New H3C, is seeing server export value expand, leveraging two major export routes to target ASEAN and Central Asian markets.
Yen Chou
Wednesday 15 April 2026