SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain

Levi Li

, Jerry Yang, Taipei, DIGITIMES

Jun 18, 2026, 10:09 0

Credit: AFP

A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis showed the HiSilicon Kirin 9030 processor was made on SMIC's third-generation 7nm-class N+3 process with a local metal pitch...

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