Imec, Sony unveil backside interconnect method for 3D chip stacking

Sherri Wang

, DIGITIMES, Taipei

Jun 18, 2026, 15:10 0

Schematic comparison of conventional via-middle and local-BDI TSV approaches. Credit: imec

Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic...

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