CONNECT WITH US

Samsung to break ground on Onyang HBM expansion in October, targets 2029 production

, DIGITIMES, Taipei
0

Samsung Electronics plans to break ground in October 2026 on a KRW 1.3 trillion (approx. US$884 million) expansion of its Onyang semiconductor packaging site in South Korea, targeting high-bandwidth memory (HBM) mass production in May 2029.

The article requires paid subscription. Subscribe Now