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SK Hynix seeks US engineers for 3D stacked DRAM push

, DIGITIMES, Taipei
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SK Hynix CDO Ahn Hyun discusses memory-logic integration at TSMC Technology Symposium 2026. Credit: SK Hynix

SK Hynix is recruiting engineers in San Jose to co-design 3D stacked DRAM-on-logic with US customers, extending its custom memory strategy beyond high-bandwidth memory and toward on-device AI applications.

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