Exclusive: STATS ChipPAC readies broad packaging price hikes on AI-driven OSAT squeeze

Staff reporter, Taipei

Aug 7, 2026, 12:15 0

Credit: STATS ChipPAC

AI chip demand is sustaining a global rise in semiconductor packaging and testing prices, with STATS ChipPAC preparing a broad round of price increases for the second half of 2026...

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