Xintec readies 12-inch IVR backside copper for TSMC's next-gen AI chips

, Taipei

Aug 18, 2026, 17:05 0

XinTec chairman CH Chen. Credit: DIGITIMES

TSMC is expanding cooperation with packaging and testing affiliate Xintec as it develops next-generation power delivery and advanced packaging for AI chips, while market speculation points to a broader outsourcing role for the company in CoWoS back-end...

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