Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package while scaling up glass panel sizes? If so, visit iCometrue at Booth M0957, Hall 1, 4F, Taipei Nangang Exhibition Center during SEMICON Taiwan 2026!
Glass substrates have emerged as a promising platform for large-size, high-performance AI multichip packages due to their superior thermal, mechanical, and electrical properties. At SEMICON Taiwan 2025 last year, iCometrue exhibited the Through-Polymer-Via (TPV) Connector, a novel technology that provides vertical interconnection in Glass Cores for use in Glass Interposers and BGA substrates to solve the microcrack problem in glass substrates caused by TGV fabrication.
At SEMICON Taiwan 2026 this year, iCometrue plans to exhibit solutions for delivering 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in the high-performance AI multichip package. The solutions include:
1. Embedding Cu blocks in glass substrates for power/ground delivery: Reducing the number of TPVs/TGVs originally used for power/ground delivery by 80%, thereby lowering fabrication complexity, improving manufacturing yield, and reducing manufacturing costs.
2. Packaging Voltage Converter/Regulator (VCR) chips in the AI multichip package: Allowing high-voltage (for example, 48V) power supply input to the package and reducing power supply voltage (for example, down to 1V) within the package, based on the copper-block-based low resistance power delivery system. The innovated copper-block-based low resistance power delivery system reduces the heat generation.
3. Embedding Si bridges, deep-trench decoupling capacitors (DTCs), and Voltage Converter/Regulator (VCR) chips in the frontside interconnection scheme over the glass substrate: Silicon bridges, DTCs, and VCR chips are embedded directly into the frontside interconnection scheme over the glass substrate, leaving large holes in the glass substrate dedicated to TPV connectors and copper blocks to streamline manufacturing.
4. Installing electrical/optical connectors at the edges of the AI multichip package: This architecture uses electrical and/or optical connectors at the package edges for power and signal input/output, replacing the conventional power and signal routing that traditionally relied on bottom solder balls. This unleashes a TPV/TGV-free System-on-Panel (SOP) package, allowing thicker glass substrates that drastically reduce panel bending and enable larger manufacturing panel sizes.
By using innovations mentioned above, iCometrue provides a scalable, practical alternative to traditional TGV processes. These breakthroughs extend Moore's Law into the era of glass-based system packaging, accelerating high-performance computing (HPC) and AI applications.