marketing

REALTIME NEWS

Chart: Nvidia's segment split tells only half the AI demand story

Nvidia buys Hugging Face for US$12.9 billion, tying open-source AI to chip dominance

China shifts autonomous driving liability to automakers in draft traffic law

Electric Vehicles

China's AI software strategy gains scale as OpenHarmony ecosystem tops 1.35 billion devices

CXMT DDR5 closes in on SK Hynix at 8,000 MT/s, benchmark gap falls below 1%

SK Hynix questions PIM as heat and packaging emerge as HBM limits

Tomorrow's Headlines

Doosan develops 13µm ultra-thin CCL for memory chip substrates

Tomorrow's Headlines

Home Tech Semiconductors

AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp

Siu Han

Siu Han

, Taipei

Aug 27, 2026, 10:21 0

Powertech Technology chairman D.K. Tsai Credit: Siu Han

Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027...

The article requires paid subscription. Subscribe Now

LOGIN

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

Enterprise first-time login?

Forgot your password?

Create your free account

Select premium stories & daily editor picks.
Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.

No credit card required

Research_DB

ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

reportAIglasses

MOST-READ
7 DAYS NEWS