Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As a core element of semiconductor value creation, advanced packaging technology is scaling the stacking of more computing cores, more high-bandwidth memory, as well as the adoption of modular chiplet integration to overcome physical boundaries. Leading semiconductor manufacturers are expanding package dimensions to unprecedented footprints, currently reaching sizes of 100, 120, with projections moving beyond 180 mm to support large-format AI-driven advanced packages.
The semiconductor industry is responding and shifting toward solutions that combine large-scale mass production with large-format packaging capabilities. Square sized substrates offer a distinct area utilization advantage to accommodate more large-form-factor chips simultaneously by moving away from round wafers to large rectangular panels. This is improving cost efficiency and addressing the challenges of thermal warpage and high-density interconnects associated with massive AI packages.
Glass substrates are emerging as a key technology for advancing panel-level packaging from pilot experiments to active equipment qualification and commercialization verification. Consequently, Redistribution Layer (RDL) wet process and ECD equipment has become a critical driver of this transition and a key step in glass substrate manu-facturing. Key production tools including Electrochemical Deposition (ECD), cleaning, developing, etching, and stripping are not only vital to glass core substrate manufacturing, but also central to achieving high yields and mass production capabilities in advanced packaging technologies such as fan-out panel-level packaging (FOPLP) and Chip-on-Panel-on-Substrate (CoPoS). The wet processing equipment has garnered significant market attention.
Omni production platform supports cross-sized substrates in 310, 510 and 700mm panel
Manz Asia, has successfully delivered Omni 310 system, which is the world’s first $310\text{mm} \times 310\text{mm}$ ECD wet chemistry system in early 2026. The system uses an electrochemical deposition module as its core, combining wet processing tools including cleaning, developing, plating, etching, stripping, and dual mechanisms support for both spin and spray operation. This new platform addresses the adaption to varying rectangular substrates.
At SEMICON Taiwan 2026, Manz Asia expanded its portfolio with the launch of the cross-sized Omni series production systems. Engineered for varying panel dimensions, packaging architectures, and strict process requirements, this series feature the Omni 310, Omni 510, and Omni 700 to deliver optimized panel-level packaging (PLP) solutions across 310mm, 510mm, and 700mm panel sizes to meet the requirements of advanced PLP technology roadmaps including FOPLP, CoPoS, and Glass core TGV manufacturing.
Take early-move positioning for Glass Core substrate aiming to tackle Through-Glass Via challenges
Rapid advancements in CoPoS are driving the shift from organic substrates to Glass Core, with TGV metallization, seed-layer formation, and copper via filling emerging as key process challenges. The Omni Series RDL platform integrates glass surface modification, cleaning, electroless copper plating, and electroplating to enhance copper adhesion and enable reliable TGV metallization and filling. Major Benefits of Omni series include.
High performance ECD technology: The system offers excellent capabilities for filling high-aspect-ratio through-vias. When combined with an optimized seed layer and specialized plating chemistry, this process enables void-free via filling, delivering a highly stable and critical solution for electroplating on glass carrier substrates.
High-precision glass etching technology: Featuring robust glass micro-machining capabilities, this technology supports the processing of 0.4 mm glass substrates and the creation of $20\ \mu\text{m}$ micro-vias. It offers TGV process capabilities with aspect ratios of up to 1:20, providing a critical advantage for achieving deep, fine-featured vias. Therefore, the system addresses the challenges of high-density TGV designs and marks a milestone in establishing a mass-production platform for next-generation packaging architectures.
Empowering Heterogeneous Integration with advanced RDL for High-Precision Multi-Layer Interconnection
With 40 years of in-house R&D expertise in RDL processing, Manz Asia has developed extensive expertise across PCB, IC substrate, display panel, and semiconductor packaging applications, and is now building strong collaborations with global IDM and OSAT clients. By helping customers accelerate key process iterations and transition smoothly to mass production, Manz Asia plays an active role in the global RDL processing and panel-level packaging supply chain.
Designed for next-generation advanced packaging technologies like CoPoS, FOPLP, and Glass Core TGV, the debut of the Omni series production systems helps customers accelerate their transition from R&D validation to mass production. To learn more about Manz Asia production systems and product offerings, please visit the booth M1248, 4th Floor, Hall 1, Nangang Exhibition Center at SEMICON Taiwan 2026. You can also view detail product information on the official website.