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NEWS TAGGED SEMICON TAIWAN
Thursday 26 September 2024
Quebec's strategy for closing America's semiconductor talent gap
The existing competitive edge has prompted the birth of a semiconductor Innovation Zone in the city of Bromont, located in Quebec, Canada. World leaders like IBM, Teledyne DALSA,...
Monday 9 September 2024
India roundup: India's Kaynes reaffirms commitment to Telangana despite Gujarat project approval
Ahead of SEMICON India, the Indian government approves a chipmaking facility proposed by Kaynes Semicon, which commits to setting up multiple chipmaking projects in more Indian sta...
Monday 9 September 2024
Samsung and SK Hynix vie for HBM dominance as both advance 16-layer technology
As SK Hynix and Samsung Electronics compete for dominance in high bandwidth memory (HBM), each is championing different technical solutions. Meanwhile, Samsung continues to address...
Friday 6 September 2024
Dutch tech powers next-gen manufacturing, from chips to cloud
Several Dutch companies showcased cutting-edge technologies at SEMICON Taiwan 2024, contributing to advancements in semiconductor manufacturing and data center infrastructure.
Thursday 5 September 2024
Two Indian startups showcase innovations at Semicon Taiwan 2024
Two Indian startups, Silizium Circuits and Calligo Technologies, are making their mark at Semicon Taiwan 2024, as they seek to establish a foothold in the global semiconductor mark...
Wednesday 28 August 2024
3S Silicon will unveil its latest development of the 3S Open Lab Platform, helping RD teams turn smart concepts into valuable reality, for EV Power Modules packaging
Under the theme of "3S Open Lab Platform," 3S will present its achievements and advancements at SEMICON Taiwan 2024, showcasing the unique capabilities of the 3S Open Lab Platform.
Wednesday 28 August 2024
Reliya attends SEMICON 2024 along with gas equipment from ASDevices, Simpure, Tiger Optics
In today's fast-growing industry, the accuracy and stability of gas equipment are indispensable to semiconductor manufacturing. As an integrator in the gas field, Reliya Tech. has...
Wednesday 28 August 2024
Henkel Semiconductor capillary underfill enables complex AI and HPC large body advanced packaging designs
Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding...
Monday 26 August 2024
SEMICON Taiwan 2024 achieves record scale; dozens of industry leaders set to give keynote speeches
SEMICON Taiwan 2024, is set to take place on September 4, with over 200 industry leaders from the global high-tech and semiconductor sectors expected to attend.
Tuesday 6 August 2024
SEMICON Taiwan 2024 to spotlight AI chain, advanced processes, heterogeneous integration, and more
SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes,...
Thursday 22 February 2024
SEMICON Taiwan 2024 to launch 'precision machinery zone' amid rise of integrated mechatronics supply chain

Taiwan's machinery and electronics manufacturing sectors are rapidly integrating into a "mechatronics supply chain," with a dedicated "precision machinery zone" to be...

Tuesday 19 September 2023
AI boom sparks silicon photonics applications
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Monday 11 September 2023
With heterogeneous integration technology constantly evolving, EVG sheds lights on hybrid bonding and NIL trends
Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology...
Monday 11 September 2023
Advanced packaging and testing takes step in four major sectors, showcasing several high-end test interfaces
Advanced packaging and testing technologies shined brightly at SEMICON Taiwan 2023 due to a focus on AI, HPC, and automotive chips. This included various showcases of new products...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research