At SEMICON Taiwan 2026 Booth T9116, SiliconAuto will showcase automotive-grade silicon solutions for Physical AI, developed through collaboration across Taiwan's world-leading semiconductor ecosystem. Visitors can experience live demonstrations of technologies designed to power future robotics and autonomous driving applications. The solutions are built on the XMotiv M3 microcontroller and high-performance computing (HPC) platforms used in intelligent vehicles and robots.
Throughout the exhibition, the SiliconAuto team will be on hand to discuss practical approaches to Physical AI development. Topics range from semiconductor architecture and system design to multi-die integration and packaging. Visitors can also get hands-on with XMotiv M3 developer kits for robotic motion control, automotive body control, and safety orchestration.
Automotive-Grade Silicon, Purpose-Built for Safe and Secure Physical AI
Experience SiliconAuto technologies in action through three demonstrations, spanning robotics, autonomous driving, and high-performance computing.
First of all, the XMotiv M3 as an ASIL-B Robotics Controller. In collaboration with Nexuni, a Taiwanese robotics developer focused on bringing AI-powered robots into practical, everyday applications, SiliconAuto is debuting a robotic motion control developer kit. XMotiv M3 controls dynamic stabilization through joint actuators. The demonstration highlights XMotiv M3's high-speed interface capabilities. These capabilities enable real-time control. ASIL-B compliance lays the safety and security foundation.
Secondly, XMotiv M3 for Autonomous Driving. See how MCU XMotiv M3 works alongside ZF's I/O interface chip to support autonomous driving capabilities up to Level 4. This autonomous driving solution was first unveiled at Embedded World 2026 where it received the Embedded Award in the SoC/IP/IC Design category. The solution demonstrates XMotiv M3 performing safety orchestration, including system management and security functions.
Moreover, the Physical AI Multi-Chiplet System. Get an exclusive preview of SiliconAuto's next-generation Physical AI inference solution. The solution is built on an automotive-grade high-performance computing (HPC) chiplet architecture, designed to meet the demanding requirements of future autonomous vehicles and advanced robotics platforms. The demonstration is powered by the SiliconPilot digital twin, which provides a pre-silicon model for validation and development.
As Physical AI drives the emergence of autonomous vehicles and robots, SiliconAuto is helping customers bridge the gap between AI thinking and physical action. Through automotive-grade silicon solutions, built on XMotiv M3 microcontroller, high-performance computing (HPC) platforms, vehicle-to-everything connectivity solutions, and collaboration across Taiwan's world-leading semiconductor ecosystem, the company is enabling the next generation of safe and secure Physical AI systems. To know more about SiliconAuto, please visit during SEMICON Taiwan at Booth T9116, Level 7, TaiNEX Hall 2 or visit offcial webiste.
