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Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding

, DIGITIMES, Taipei
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Credit: Samsung

Samsung Electronics has reportedly revised the roadmap for its first sub-10nm DRAM generation, making a wafer-to-wafer hybrid-bonding architecture the baseline for its D0a process while moving its vertical-channel-transistor (VCT) design to a separate D0a-V...

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