Four glass makers converge on 510x515mm substrate, hinting at TSMC's next move

Rebecca Kuo, Tainan

Oct 1, 2026, 13:56 0

Credit: DIGITIMES

As AI chip sizes scale up, global glass leaders Corning, AGC, Nippon Electric Glass (NEG), and Schott have all centered their next-generation core substrate and through-glass via (TGV) roadmaps on a unified 510×515mm format...

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