Chenbro, a leading professional server chassis manufacturer, announced today its participation in the OCP Global Summit 2026, taking place from October 13 to 15 in San Jose, California. In response to the surging global demand for AI applications and data center infrastructure, Chenbro's exhibition this year revolves around three core themes: "Vision & AI Engineering," "Agile R&D, Infinite Creation," and "Manufacturing Globalization." The company will prominently showcase AI server chassis and rack-level solutions compatible with mainstream platforms, fully demonstrating Chenbro's powerful integration capabilities in next-generation AI infrastructure.
Meeting Diverse AI Computing Needs with Comprehensive Support for Next-Generation NVIDIA and AMD Platforms
To tackle the high power consumption, thermal dissipation, and heavy load-bearing challenges brought by next-generation AI computing, Chenbro leverages its profound expertise in mechanical and thermal design to fully support the latest architectures of next-gen platforms.
Regarding NVIDIA solutions, Chenbro is showcasing its NVIDIA MGX rack-level solutions along with multiple high-performance models, including the 1U and 2U NVIDIA Vera Rubin series, NVIDIA Vera series, as well as the 4U NVIDIA ConnectX-8 SuperNIC and 6U Liquid-Cooled PCIe server chassis. The featured NVIDIA MGX rack has also been selected to be displayed at the "NVIDIA Ecosystem Wall" at the exhibition, highly highlighting Chenbro's close partnership in advancing AI infrastructure.
For AMD solutions, Chenbro is concurrently presenting the AMD Helios platform and high-density solutions tailored specifically for AMD's next-generation GPU architecture. By launching dual-platform solutions for both NVIDIA and AMD, Chenbro strongly asserts its high adaptability to meet the needs of different chip camps and diverse computing architectures. Furthermore, to accommodate clients' flexible deployment requirements, the company is also exhibiting modular chassis compliant with the DC-MHS architecture, demonstrating comprehensive support for new-generation CPU platforms.
Agile R&D Combined with a Global Footprint to Accelerate AI Infrastructure Deployment
For large-scale and highly customized high-end rack products, Chenbro demonstrates a complete roadmap from forward-looking design to glocalized production. In terms of R&D and manufacturing processes, through AI-Accelerated Design, optimization of key rack manufacturing processes, and LCIM automated lean manufacturing, Chenbro comprehensively accelerates the entire process—from front-end mechanical development and system validation to laser welding at the manufacturing end—dedicating itself to enhancing quality and delivery efficiency.
Regarding capacity layout, Chenbro has established a comprehensive "Glocalization" manufacturing platform. Building upon the massive capacity foundation of its existing server chassis business, the company is gradually expanding its rack-level production capabilities. Taiwan, serving as the R&D and high-end manufacturing core, is continuously expanding its chassis and rack capacity as planned. In addition to their existing mass-production advantages in server chassis, the Kunshan and Dongguan facilities in China are progressively adding rack production lines to assist with capacity delivery. Moreover, combining the New Product Introduction (NPI) and backend assembly capabilities of the US facility, along with the new Malaysia plant (slated for mass production ramp-up in Q4 this year) and the upcoming Vietnam plant (expected to begin production in H1 2027), Chenbro has tailor-made a multinational supply chain with high defensive resilience and scalability for global CSPs and ODMs.
Solving System Pain Points as the Foundation for "Built to Scale"
"Competition in the AI server industry is no longer confined to the manufacturing cost of a single product; it is a comprehensive system battle ranging from mechanical design, thermal dissipation, and load-bearing capacity to global delivery," said Corona Chen, CEO of Chenbro. "Through our 'Early Engagement' model, Chenbro collaborates with chip giants like NVIDIA and AMD, as well as ecosystem partners, to jointly define next-generation product specifications and help clients efficiently resolve system pain points. The dual-camp rack and liquid cooling solutions showcased at OCP this time are the best testament to our agile R&D strength. Meanwhile, through an all-encompassing global manufacturing layout, we are fully prepared for the company's next phase of 'Built to Scale.'"
Chenbro will continue to uphold its five core service values—Innovative Design, Exceptional Quality, Flexible Customization, Global Support, and Sustainable Solutions—deepening its collaboration with global ecosystem partners. We sincerely invite industry professionals worldwide to visit the Chenbro booth to explore innovative applications for next-generation AI infrastructure.
