J.K. Wang, a veteran leader in the semiconductor industry and former COO of TSMC, shared insights on TSMC's large-scale wafer fab mass production during his first media interview since retirement. Speaking on DIGITIMES' IC Broadcasting podcast, Wang highlighted how TSMC's success stems from meticulous teamwork rather than any single individual

Dublin-based semiconductor startup CHIPX plans to build an 8-inch gallium nitride on silicon carbide wafer fabrication plant in Malaysia to meet rising demand from artificial intelligence (AI) data centers and high-voltage power electronics, CEO and founder Chinmoy Baruah told DIGITIMES Asia. The project aims to establish a front-end manufacturing presence in Southeast Asia, with the company expecting to reach key milestones beginning in January 2026

The rapid growth of generative AI and large-scale models has significantly increased power consumption in computing chips, pushing thermal management into critical focus. High-end AI accelerators now consume power at kilowatt levels, producing concentrated heat fluxes that challenge existing cooling methods, potentially limiting performance and reliability across data center systems

SpaceX is widely expected to pursue an initial public offering in mid to late 2026. In anticipation, investors have increasingly tied the company's long-term growth story to the idea of orbital—or space-based—data centers, making the concept one of the most closely watched themes in capital markets

The long-rumored transfer of Luxgen, the automotive brand under Yulon Motor, to Foxtron Vehicle Technologies—a joint venture between Foxconn and Yulon—was formally confirmed on the evening of December 19. The announcement has drawn intense scrutiny from both financial markets and the manufacturing sector, as its ripple effects across Taiwan's automotive supply chain continue to unfold

The isolation of graphene in 2004 sparked widespread expectations that two-dimensional (2D) materials could fundamentally reshape electronic devices. Graphene and transition metal dichalcogenides (TMDs) have since enabled progress in niche applications and research prototypes. Yet their impact on mainstream logic devices remains limited. The long-anticipated use of 2D materials to sustain Moore's Law through transistor channel integration has yet to materialize at scale

Former COO of TSMC and a veteran semiconductor industry leader, J.K. Wang, shared insights from his 30-plus-year career at the company in an exclusive interview with DIGITIMES' IC Broadcasting podcast, marking his first media interview since retirement

China's GPU start-ups are back at the center of a capital-market frenzy. Following Moore Threads, five-year-old MetaX has listed on Shanghai's STAR Market, with its shares surging more than sevenfold on debut. At its peak, the company's market capitalization briefly hit CNY330 billion (US$46.9 billion)—a striking number for a business generating just CNY1.5–2 billion in annual revenue, and one that would raise eyebrows even by global semiconductor standards

As humanoid robots emerge as a key technology riding the wave of AI, the US and China are rapidly forming two competing camps. Industry insiders analyzing their strengths say the US holds an edge mainly in software and foundational models, while China slightly outpaces the US in hardware innovation and iteration speed, with costs reportedly just one-fifth those of American products, making it difficult for other countries to catch up in the short term

Intel is reportedly seeking to acquire SambaNova, a prominent AI inference chip specialist. The deal has a high probability of closing, primarily due to a significant governance alignment: Intel's current CEO, Lip-Bu Tan, also serves as SambaNova's Executive Chairman

AI is inevitably driving innovation in global server architecture. AI servers differ significantly from traditional servers in design philosophy and operational mode. This reflects not only innovations in computing architecture but also emerging challenges in energy consumption and thermal management driven by rapidly increasing computational demands

Broadcom reported strong AI-related order growth but noted lower gross margins for ASIC products compared to non-AI items, causing market uncertainty about 2026 revenue. Industry experts explained that lower ASIC margins are common due to customer-driven design changes and production timing

Singapore is expanding its domestic semiconductor capabilities through AI-focused workforce programs, SME digitalization efforts, and new research infrastructure, according to Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA)

Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's leadership

As the US–China tech confrontation drags on, discussions consistently return to chips, semiconductors, rare earths, and tariffs. Despite accelerating supply-chain decoupling and overseas clients pushing for "Out-of-China" capacity, China remains the world's largest PCB manufacturing base and has fully captured both the volume and value gains from the AI server cycle. The country continues to demonstrate cost and efficiency advantages over production in Taiwan and Southeast Asia