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Monday 5 October 2026
Podcast highlights: TSMC Texas plant talk is premature, Intel 18A hits backfiring criticism
This excerpt from DIGITIMES analyst Luke Lin's podcast looks at TSMC's rumored Texas expansion, Intel's 14A and 18A process debate, and Qualcomm's high bandwidth compute (HBC) push as AI workloads drive demand for hybrid bonding and advanced packaging.
LATEST STORIES
Saturday 3 October 2026
Interview: AI PCs reach 65% of Europe's notebook channel, but what brings buyers to the market?
The rapid iteration of AI-capable hardware, following an industry-wide push toward integrating AI-processing capabilities into PCs, is bringing renewed attention to what AI could offer as its presence extends further into the notebook market. But beneath the expanding promise of these machines lies a less straightforward question: what is actually compelling buyers to bring them into their businesses and homes?
Friday 2 October 2026
DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide
Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply current into the thousands of amperes. In conventional frontside power delivery, current must cross the full metal interconnect stack before reaching the transistors, while power and signal lines compete for routing resources. Intel Foundry estimates that raising a single compute package from 1kW to 5kW increases power delivery network I²R losses from 89W to 2,222W, cutting the share of input power reaching the transistors from 66.0% to 41.8%.
Friday 2 October 2026
Commentary: Broadcom's US$42 billion Anthropic loan exposes AI's emerging chip-financing loop
When the underlying economics of infrastructure commitments meet the financing muscle of the companies supplying foundational compute, the traditional boundary between supplier and customer begins to blur.
Friday 2 October 2026
Column: AI benchmarks remain lucrative business
New AI models arrive every few weeks, and the question of which is better often comes down to the leaderboard. Behind those rankings, evaluation can look like an academic exercise in setting rules, running tests, and assigning scores. However, public benchmarks—and strong placement on them—have long been tied to a lucrative business, with money flowing to different players in different eras.
Friday 2 October 2026
Commentary: AMD challenges Nvidia in embodied AI as Lisa Su acquires Fei-Fei Li's World Labs
Advanced Micro Devices (AMD) has agreed to acquire World Labs in an all-stock transaction valued at approximately US$8.2 billion. Following the closing, World Labs will operate as a dedicated frontier research organization for large language models (LLMs) and spatial intelligence, with founder Fei-Fei Li joining AMD as executive vice president and chief scientist, reporting directly to Chair and CEO Lisa Su.
Thursday 1 October 2026
Analysis: China's AI data center buildout vaults to No. 2 as Big Tech capex races toward US$100 billion
China's rapid expansion of AI applications is driving a fresh wave of data center construction. SemiAnalysis estimates that the country has already delivered more than 24GW of data center capacity and will remain above that level by the end of 2026, making China the world's second-largest data center market after the US.
Thursday 1 October 2026
5 issues to watch as Nvidia bets on hardware for AI agent security
Nvidia's new AI agent security platform puts hardware at the centre of agent control, but it also forces enterprises to weigh stronger protection against higher infrastructure costs and deeper dependence on Nvidia's stack.
Thursday 1 October 2026
DIGITIMES Insight: AI scaling is moving from chip shrinkage to system integration
TSMC said the next phase of AI performance growth will depend less on shrinking a single chip and more on combining multiple chips, memory, and advanced packaging inside larger systems. The shift could reshape semiconductor competition, as demand for compute, bandwidth, power delivery, and cooling rises in tandem. The company outlined the trend at its heterogeneous integration forum during SEMICON Taiwan 2026, saying AI computing transistors in a single CoWoS package are set to rise more than 48-fold by 2029 from 2024 levels, while total HBM bandwidth is expected to increase more than 34-fold.
Thursday 1 October 2026
DIGITIMES Insight: Agentic AI shifts inference bottleneck to token control and task quality
DIGITIMES Intelligence observes that AI applications are moving through a clear progression: from early classification AI focused on feature recognition, to generative AI capable of creating content, and toward a broader shift into the agentic AI era in 2027. Agentic AI is expected to multiply compute demand, while multi-step reasoning introduces new risks to task quality. Efficient control of total token consumption and reliable task-quality management will therefore become critical to commercial deployment.
Wednesday 30 September 2026
DIGITIMES Insight: AI is emerging as the new growth anchor in the mobile communications industry
South Korea's leading telecommunications operator, SK Telecom (SKT), recently established SK Hyper and SK Horizon in quick succession. The moves mark a pivotal shift for telecommunications AI, signaling a transition from internal operational optimization toward full-scale infrastructure monetization.
Wednesday 30 September 2026
Interview: iFLYTEK Medical sees clinical integration as key to healthcare AI expansion in South Korea
Xunfei Healthcare (iFLYTEK Medical), the healthcare AI arm of China's iFlytek, is using its Spark Medical Large Model to support diagnosis and medical record generation while tackling challenges including clinical workflow integration, differences in care settings, and model hallucinations. It also hopes to bring its experience from China to South Korea through local partnerships.
Wednesday 30 September 2026
Column: Memory and logic collide as AI shifts the balance
As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge that has shaped nearly half a century of semiconductor development.
Wednesday 30 September 2026
Commentary: What risks does China's DRAM capacity face amid tightening market?
China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?
Wednesday 30 September 2026
Commentary: Garmin returns to OLED, putting Micro LED on notice
Garmin's decision to offer OLED options but no Micro LED version in its new flagship smartwatches, the fenix 9 and fenix 9 Pro, has revived debate over whether the emerging display technology is ready for sustained commercial competition. The shift comes about a year after Garmin launched the world's first Micro LED smartwatch, the fenix 8 Pro Micro LED in September 2025.
Tuesday 29 September 2026
Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with a pledge to invest more than US$250 billion in the US by 2035. The fund is designed to give Micron an early look at technology shifts, position it for next-generation AI architectures, and strengthen its strategy to reduce memory-cycle volatility.