As competition in the semiconductor industry intensifies, TSMC maintains its lead while actively supporting the domestic supply chain. In recent years, driven by the need for cost reduction, breaking international monopolies, and the ability to respond rapidly to disruptions, TSMC has taken multiple actions to nurture local suppliers. Notably, TSMC has played a critical role as a "supply chain stabilizer," stepping in during key moments

The global AI industry is shifting into an inference cost war in 2026, with DeepSeek V4 accelerating changes across China's semiconductor supply chain. By positioning Huawei's Ascend chips as viable alternatives to Nvidia GPUs, DeepSeek reframes competition beyond software versus hardware. The shift cuts deeper, reshaping how AI systems are architected from the ground up

For years, the global auto industry has been enveloped in the promise of the software-defined vehicle. But at the 2026 Beijing International Automotive Exhibition, a more grounded reality came into focus: without sufficiently powerful hardware, software ambitions risk remaining just that—ambitions

Texas Instruments (TI) plans to showcase its 800V power architecture-based AI data center solutions at Computex 2026, featuring applications in humanoid robots, automotive, and edge AI. Ahead of the event, TI executives have been engaging with local Taiwanese supply chains to explore collaborations

Optical communication technology is shifting from traditional pluggable optics toward co-packaged optics (CPO) architectures. Advanced packaging technologies are extending from wafer-level to panel-level, bringing fan-out panel-level packaging (FOPLP) into the spotlight. At the intersection of these trends, Taiwan's panel manufacturers are actively entering the semiconductor packaging field in search of new growth momentum

The 2026 Beijing International Automotive Exhibition opened on April 24 with a scale that stands in sharp contrast to the contraction of many global auto shows. Spanning roughly 380,000 square meters and drawing more than 2,000 exhibitors, the event has become one of the clearest barometers of where the automotive industry is heading

When DeepSeek unveiled its V4 model, it ended with a line from ancient Chinese thinker Xunzi: ignore applause and criticism, and focus on doing things the right way. In today's AI context, the message reads less like philosophy and more like positioning

Across both sides of the Pacific, robot startups and leading laboratories have reached a consensus over the past year that model architecture is no longer the sole focus. Data has become the core competitive resource. Regardless of how technical approaches evolve, most teams eventually encounter the same problem: the shortage of training data

For more than a decade, lithium-ion batteries have defined the global power battery market, concentrating technology, capital and supply chains along a single trajectory. That model is now under pressure. Sharp swings in lithium carbonate prices have exposed structural vulnerabilities, forcing the industry to confront a long-ignored question: what happens when the core input cost is no longer predictable

The trajectory of DeepSeek has drawn scrutiny, but its latest move marks a clear inflection point. According to a report by The Information, the company is seeking external funding for the first time, triggering strong interest from China's major tech groups. Four sources familiar with the matter said Tencent and Alibaba are in discussions to invest

SK Hynix Inc. has moved to deepen its presence in the US by building an HBM packaging and testing plant and planning a US stock exchange listing to raise capital — steps that could bolster local high-bandwidth memory supply and reshape competition with Micron Technology Inc

Amid volatile geopolitical tensions affecting Japan's components, manufacturing, and end-user sectors, Seiko Epson unveiled its Engineered Future 2035 long-term vision. The plan aims to shift Epson from a traditional printer maker into a value-driven company focused on technology innovation and engineering excellence, with improving return on invested capital as a core discipline

Apple has officially confirmed long-rumored news that Tim Cook will step down as CEO in September 2026, handing over leadership of the US$4 trillion tech giant to senior vice president of hardware engineering John Ternus. Unlike Cook, known for his supply chain mastery, Ternus is well-known as a pure "product person" and engineer

Apple has officially announced that John Ternus will succeed Tim Cook as CEO. Given Ternus's deep hardware background, product innovation at the hardware level is widely expected to accelerate under his leadership. As AI development enters the era of embodied intelligence, his prior takeover of Apple's secret robotics team is seen as pivotal to whether Apple can seamlessly integrate its existing AI technologies and software ecosystem with physical hardware

"The drone is not the weapon. The infrastructure to build it is." This statement, made by Ukrainian president Volodymyr Zelenskyy on March 31, 2026, encapsulates the direction of recent US policy reforms as America strives to establish a large-scale, low-cost, and fast-iterating drone industry similar to Ukraine's. The US aims to simultaneously develop military and commercial markets while eliminating reliance on Chinese supply chains and catching up with China's small- and medium-sized drone manufacturing capabilities