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Tuesday 20 May 2025
From cold benches to courtroom benches: A tale of two chip visions
The year 2025 marks a significant moment for the Chinese-speaking semiconductor industry, presenting a striking contrast
Tuesday 20 May 2025
Huawei widens lead in global telecom race, Western RAN giants retreat under pressure
As global telecom players across Europe, the US, Japan, and South Korea face mass layoffs and resource constraints, market contraction is accelerating. Meanwhile, Huawei is bucking the trend, expanding its R&D headcount and consolidating its lead in 5G and communications infrastructure, emerging as the sector's biggest wildcard. The growing split in the global telecom race is stark: Huawei gains strategic ground, while Western peers stall amid policy inertia and financial tightening
Monday 19 May 2025
China's AI appliance chaos: DeepSeek boxes flood market as prices swing 100x between full and distilled models
Since its viral breakout in February, DeepSeek has triggered a rush for all-in-one AI appliances across China's enterprise and government markets. But the boom has also unleashed a disorderly ecosystem, with over 100 DeepSeek-branded systems flooding the market, priced anywhere from tens of thousands to more than one million CNY
Monday 19 May 2025
South Korea intercepts SK Hynix HBM China-bound tech leak
South Korean authorities arrested a former subcontractor employee at Incheon International Airport for allegedly attempting to smuggle SK Hynix's proprietary high-bandwidth memory (HBM) packaging technology to China. The suspect, identified as Mr. Kim, was apprehended moments before boarding his flight
Monday 19 May 2025
Substrate makers' China exit stalls as SEA relocation falls short
Amid the renewed US-China trade tensions and fierce price competition from Chinese peers, the industry trend of "China Minus One" has resurfaced, spreading from outsourced semiconductor assembly and test (OSAT) providers upstream to the IC substrate supply chain
Monday 19 May 2025
AI, EV boom thrusts advanced packaging to forefront of China's chip strategy
China's outsourced semiconductor assembly and test (OSAT) industry is gaining momentum, driven by surging demand for artificial intelligence (AI) and electric vehicles (EVs). As the country intensifies its technology upgrade initiatives, the back-end supply chain has become a strategic pillar, with major players ramping up both revenue and innovation
Monday 19 May 2025
Weekly news roundup: China sharpens its chip game, Samsung lands wins, TSMC widens global footprint
These are the most-read DIGITIMES Asia stories from the week of May 12 – May 18. From China's push in DUV lithography and Samsung's resurgence in foundry orders to TSMC's aggressive fab expansion and Europe's looming ban on Chinese inverters, the week highlighted shifting power dynamics across the global tech and semiconductor landscape
Monday 19 May 2025
Egis makes initial strides in South Korea as InPsytech joins SAFE
InPsytech, a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis, has been selected to join the Samsung Advanced Foundry Ecosystem (SAFE) as an IP partner. This recognition stems from InPsytech's outstanding performance in open NAND flash interface (ONFI) high-performance IP solutions. InPsytech plans to continue expanding its IP portfolio within Samsung's ecosystem, particularly by strengthening applications for UCIe IP
Monday 19 May 2025
AI windfall lifts Kioxia to record highs, but NAND headwinds loom into 2025
Japanese NAND flash memory maker Kioxia reported a sharp earnings rebound for fiscal 2024 (April 2024 to March 2025), recording a net profit of JPY272.3 billion (approx. USD 1.9 billion) after a net loss of JPY243.73 billion the year prior
Saturday 17 May 2025
Current status of China's lithography equipment development: EUV
While China's Ministry of Industry and Information Technology (MIIT) recently announced updates on deep ultraviolet (DUV) lithography, Shanghai Micro Electronics Equipment (SMEE) also disclosed its 2023 patent applications related to extreme ultraviolet (EUV) technology, along with the publication of patents filed in September 2024
Friday 16 May 2025
Akrostar, Biren, Enflame score fresh capital as China intensifies interface IP race
At the 2025 Semiconductor IP Industry Seminar in Shanghai, Akrostar Technology, Biren Technology, and Enflame Technology unveiled fresh funding rounds, highlighting China's accelerating efforts to localize critical chip technologies amid the global AI boom, as reported by ICsmart and Sina
Friday 16 May 2025
DDR4 market set for price war between Chinese and Taiwanese manufacturers after Samsung and SK Hynix exit
According to New Daily, citing semiconductor industry sources, the DRAM giants Samsung Electronics, SK Hynix, and Micron plan to exit the DDR4 market by the first half of 2026 at the latest. Taiwanese firms such as Nanya and Winbond are expected to step in and cover the market shortfall. However, they will likely face intense low-price competition from Chinese rivals
Friday 16 May 2025
BYD's independent SiC development powers breakthrough megawatt charging
Leading Chinese new energy vehicle (NEV) maker BYD grabbed market headlines in the first quarter of 2025 with the unveiling of its megawatt-level flash charging technology. Silicon carbide (SiC) semiconductors played an instrumental role in this technological advancement, as key advantages of the wide bandgap material, including high voltage and temperature resistance and low energy loss, help enhance the efficiency and reliability of electric drive systems to support high-voltage charging
Friday 16 May 2025
China's tech giants join forces to accelerate humanoid robotics push
With 2025 being hailed as the inaugural year of the humanoid robot, China's internet giants—Tencent, Baidu, and Alibaba—are accelerating their efforts to secure early dominance in the embodied intelligence industry. What began as isolated initiatives has evolved into a clear trend of strategic alignment, with major players forming increasingly collaborative ecosystems to drive development and commercialization
Friday 16 May 2025
Huawei builds humanoid robot empire with Hubble-backed AI and chip offensive
As interest in humanoid robots surges, Huawei is expanding beyond technology development by deploying capital through its tech investment arm, Shanezen Hubble Technology Investment Partnership (Hubble), to deepen its footprint across semiconductors, AI, and system integration
Research Report Database
Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES