The rapid development of large language models (LLMs) in China has led to various development bottlenecks for AI, including complex computing power management, high training and inference costs for LLMs, and task scheduling difficulties
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation Exynos processors by the end of 2024
Wafer Works, a veteran semiconductor silicon wafer foundry in China, made its debut on Shanghai's STAR Market in February 2024. Simultaneously, the company launched a major expansion project for 12-inch wafer production across facilities in Taiwan's Erlin and China's Zhengzhou, with completion expected by late 2025. Each site aims for a monthly capacity of 200,000 wafers, and construction is already underway
China's electric vehicle (EV) industry is aggressively pushing into overseas markets, navigating trade barriers from Europe and the US designed to stall its progress. However, these obstacles are only temporarily hindering China's EV exports while accelerating the relocation of its global supply chain
Onsemi and OmniVision are now in a tight race for leadership in the automotive CMOS image sensor (CIS) market, with conflicting reports from research firms about which company held the top position in 2023
While Japanese manufacturers have long been at the forefront of bipedal humanoid robot development, recent AI breakthroughs from the US and China's IT industry have propelled these innovations forward. Rows of bipedal robots showcased by tech companies at AI industry events have captivated global attention
Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics' Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth memory (HBM) and advanced packaging (AVP) through strategic organizational restructuring and reforms. According to ZDNet Korea, the DS division's recent reorganization primarily focuses on HBM, AVP, and the Equipment Technology Research Institute
As the smartphone industry enters its peak shipment season in the second half of 2024, major brands are launching new devices. Taiwan's power amplifier (PA) chip supply chains, including Win Foundry, AWSC, and VPEC, are experiencing impressive sales results
Japan Advanced Semiconductor Manufacturing (JASM), a subsidiary of Taiwan Semiconductor Manufacturing Company (TSMC), is set to significantly increase its workforce in spring 2025. The company plans to hire over 600 new employees, more than doubling its intake compared to early 2024. This substantial boost in recruitment is aimed at staffing two new semiconductor factories in Kumamoto Prefecture, Japan. The first facility is scheduled to commence chip production in 2024, with the second planned to open in 2027
The Semiconductor Equipment Association of Japan (SEAJ) has revised its forecast for fiscal 2024 (April 2024 to March 2025) sales of semiconductor equipment produced by Japan-based manufacturers. The new estimate projects a 15% year-on-year increase, reaching JPY 4.2522 trillion (approximately USD 27.1 billion). This represents an upward revision of over 5% compared to the January 2024 estimate
Since being blacklisted by the US Department of Commerce in 2019, Huawei has not given up efforts to break out of US export control restrictions. A Chinese technology tycoon observed that Huawei is emulating successful US companies to strive for survival
To concentrate more on its AI chip business, Samsung Electronics has reportedly decided to adjust the development pace of its "Exynos Auto" automotive chip project, which has been in the works for six years. Samsung will instead focus on R&D for new chips, such as the inference AI accelerator "MACH.
The recent 618 sales event saw mixed results across different product categories. While smartphones and displays experienced growth, sales of PCs and TVs did not meet expectations
Glass core substrates (GCS) are poised to play a crucial role in next-generation advanced chip packaging. In response, Japanese and South Korean semiconductor supply chain players are intensifying their efforts to develop GCS solutions or acquire companies with related technologies
