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Friday 11 September 2026
Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward higher performance, increased density, and larger footprints, both companies are competing for dominance in this high-value-added advanced packaging market.
Friday 11 September 2026
Memory makers gain the upper hand as Apple's iPhones pay the price
Apple has raised prices on both its new iPhone 18 Pro series and older models, including the iPhone 17, as rising memory costs push up component expenses.
Friday 11 September 2026
Enflame enters public markets with Nvidia alternatives in its sights

Chinese AI chipmaker Enflame Technology made a striking debut on Shanghai's STAR Market on Friday, with its shares opening 188% above the IPO price after raising CNY6.12 billion (US$912 million). The listing gives the Tencent-backed company fresh capital to fund its next generations of AI processors and large-scale computing systems, while sharpening attention on China's effort to build alternatives to Nvidia.

Friday 11 September 2026
Huawei stakes out the AI optics rulebook with 7.2Tbps NPO
Huawei Technologies has unveiled a 7.2-terabit-per-second near-packaged optics (NPO) module for AI data centres, coupling a high-bandwidth product launch with an effort to shape emerging optical-interconnect standards as AI clusters strain the limits of copper connectivity.
Friday 11 September 2026
China's DRAM supply chain clears another materials hurdle
China's semiconductor localisation effort has reached another upstream materials milestone.​ Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products at a domestic DRAM manufacturer capable of large-scale production.
Friday 11 September 2026
CIOE 2026: Automotive optical-module demand could rival FTTx shipments by 2030
Automotive optical-module demand could approach the scale of the established FTTx market by around 2030 as increasingly data-intensive vehicles shift high-bandwidth connections from copper to fiber, according to Bai Qiang, deputy director for the automotive market at Xiamen UX IC Co. (UXIC).
Friday 11 September 2026
China's energy storage capacity surges 50-fold in five years, sparking crackdown on lithium battery expansion
China's energy storage industry has expanded at breakneck speed since the launch of the 14th Five-Year Plan, growing 50-fold in just five years. The government is now applying the brakes, as local government support has helped spawn large numbers of speculative "energy storage cockroaches"—companies that secure project rights without actually building the projects—causing planned capacity on paper to soar while actual construction lags far behind.
Friday 11 September 2026
SK Hynix raises cash portion of bonuses after 25-vote union rejection

SK Hynix has increased the cash portion of its profit-sharing bonus in a revised tentative wage agreement, after production workers rejected an earlier stock-heavy proposal by just 25 votes.

Friday 11 September 2026
Anthropic disrupts Chinese AI firms' attempts to extract Claude capabilities
Anthropic has disrupted a series of operations in which Chinese AI companies allegedly used its Claude models to extract capabilities for their own AI systems, highlighting growing tensions over AI model distillation and data security.
Friday 11 September 2026
China's Shenzhen Kaifa plans CNY1.85 billion expansion for high-end memory packaging and testing
Chinese electronics manufacturer Shenzhen Kaifa Technology, also known as Shenzhen Kaifa or Kaifa, plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip packaging and testing capacity through its wholly owned subsidiary Payton Technology (Shenzhen), according to a company announcement.
Friday 11 September 2026
Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%
Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a concrete design-level result as Samsung seeks to turn its 2nm technology into more commercial foundry business.
Friday 11 September 2026
ProLogium deepens partnership with Kyushu Electric Power through strategic investment

ProLogium said Kyushu Electric Power will make a strategic investment as its long-running collaboration expands from industrial cooperation into capital participation. The move signals growing confidence in next-generation battery technologies, with potential implications for energy security, manufacturing supply chains, and electrification efforts in global markets.

Friday 11 September 2026
Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end product specifications, tight supplies of critical materials, and intensifying competition in advanced packaging technologies.
Friday 11 September 2026
Samsung, SK Hynix eye 2028 High-NA DRAM rollout

SK Hynix is targeting 2028 to apply High-NA extreme ultraviolet lithography to DRAM mass production and is considering joining an industry initiative to develop 12-inch photomasks, according to South Korea's fnnews. The company has separately confirmed both plans.

Friday 11 September 2026
Quantum computer development is more about national security than profits, says expert

Japanese electronics giant NEC stopped development of gate-based superconducting quantum computer hardware at the end of March 2026. According to Japanese media reports, NEC concluded that the commercialization timeline for a physical quantum computer was too long and that hardware investment would be unlikely to deliver commensurate returns. The decision also reportedly prompted quantum R&D researchers to join Fujitsu.