At the TSMC 2024 Japan Technology Symposium held on June 28, besides discussing the previously announced A16 chip technology, TSMC also revealed that it achieved revenue growth in Japan for 2023, against overall market trends. The company projected a significant demand for AI in Japan and announced that the 3nm technology would soon be introduced to automotive chips
Chinese tech companies are embracing a 'multi-chip hybrid' strategy to enhance their ultimate AI computing power. This approach supplements foreign offerings while avoiding sole reliance on a single domestic AI chip supplier, particularly Huawei. It aids in building AI computing clusters amid intensified US attempts to curb the rapid expansion of AI computing power
The largest union at Samsung Electronics Co. said it will stage a three-day walkout beginning July 8, adding to the challenges for South Korea's largest company as it seeks to recover from setbacks in its semiconductor business
BYD Co. sold a record number of electric and hybrid cars in the second quarter, sales data compiled by Bloomberg News shows, as price cuts and new technology stoked consumers into purchases
Sony's optical disc business is facing challenges due to declining demand as data storage methods shift towards cloud-based solutions and plans to cut its workforce by 40%
OpenAI recently surprised users by announcing that, starting July 9, 2024, it will cease providing API services to China and other regions, including Hong Kong
Chinese EV giant BYD is making significant inroads into the South Korean and Japanese markets, challenging established domestic players and reshaping the competitive landscape in East Asia's automotive sector
Sony Semiconductor Solutions (SSS), the semiconductor subsidiary of Sony, announced in May 2023 that it had acquired land in Kōshi, Kumamoto, for a new factory, with plans to break ground for construction in April 2024. However, during a business briefing on May 31, SSS stated that market trends must be observed before making a final decision, sparking market curiosity about the company's strategy
Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution. For Chinese manufacturers, the question arises: what roles do front-end wafer fabrication and advanced packaging companies play, and which markets do they serve
Rumors from various sources said Huawei is partnering with Wuhan XMC to develop high bandwidth memory (HBM) to meet the robust demand for Artificial Intelligence (AI)
Samsung Electronics and SK Hynix have conducted immersion cooling technology verification tests on their semiconductors. This move is seen as a response to the emerging next-generation server cooling solutions market. The verification results will influence the development direction of new-generation semiconductors, and subsequent developments are being closely monitored
The second phase of the Chinese state-owned semiconductor investment fund invested in two startups engaged in IC design and EDA tool development, respectively
Chinese smartphone vendors face challenges in adopting AI, which has not significantly influenced consumer choices despite industry efforts. There is a noticeable disparity between aspirations and actual outcomes, exacerbated by the absence of compelling applications, leading to consumer apathy in China
Demand for mobile phones in China continues to surge, which helps to reduce the seasonal decline in global mobile phone shipments in the second quarter
