On 30 October 2025, Donald Trump and Xi Jinping met in Busan, South Korea, in a summit that could redefine the global trade and technology order. It marked their first meeting since Trump's return to the White House and their second in six years, a long-awaited rematch that drew worldwide attention

Chinese electronics manufacturer Wingtech Technology has filed a formal statement with the Dutch public broadcaster NOS, urging the Netherlands to revoke its decision to temporarily take control of Nexperia, the semiconductor company Wingtech acquired in 2019. The move marks a new flashpoint in the increasingly strained relationship between China and Europe's technology industries, as national security and industrial policy concerns collide

China's next phase of technology strategy is injecting fresh uncertainty into global supply chains, signalling a new round of strategic recalibration across industries worldwide

As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry Utsunomiya, President of Fujitsu Interconnect Technologies (FICT) under Fujitsu Limited, noted that with heterogeneous integration now the dominant approach, the industry is undergoing a crucial shift from organic to inorganic substrates