At the Apsara Conference 2025, Alibaba introduced its PanJiu AI Infra 2.0 with a 128-chip supernode, the most-watched launch of the event. The debut underscores how China's cloud leaders...
The global semiconductor industry is entering an unprecedented growth phase driven by artificial intelligence, with market forecasts projecting the sector to exceed US$1 trillion by...
Under the pressure in the high-end car market, Mercedes-Benz, a luxury brand known for elegance and composure, is revamping its strategy. Recent remarks reportedly made by Mathias...
TSMC has donated several sets of used 12-inch chipmaking equipment to the government, which has had the Industrial Technology Research Institute (ITRI) under the Ministry of Economic...
Panasonic Group's subsidiary, Panasonic Industry, announced plans to construct a new factory in central Thailand with an investment of JPY17 billion (approx. US$115 million). The facility...
At the OktoberTech Taipei event held on September 11, 2025, Infineon Technologies AG unveiled key developments in its automotive electronics portfolio, with CEO Jochen Hanebeck and...
TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...
The EU plans to implement the Corporate Sustainability Due Diligence Directive (CSDDD) in 2028. In response, South Korea is accelerating efforts to enact its own Corporate Human Rights...
Amkor Technology, Inc. announced on August 28 that it will relocate the planned site of its new advanced semiconductor packaging and test facility in Arizona to the Peoria Innovation...
Zhen Ding Technology, the world's largest printed circuit board (PCB) manufacturer, announced that its Chinese subsidiary, Avary Holding, has approved a major investment plan for its...
The microLED market—considered a "game changer" in the next-generation display panel industry—is expected to enter a rapid growth phase starting in 2028, according to market...
TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...
On July 30, US President Donald Trump issued a proclamation declaring that imports of copper and copper-based products threaten national security. The move follows a comprehensive...
DIGITIMES analyst Luke Lin says Samsung's Tesla deal marks a pivotal entry into the US advanced foundry market. He projects AI6 high-volume production from 2028, with peak...
