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NEWS TAGGED 28NM
Wednesday 26 July 2017
UMC expects flat 3Q17
United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the third quarter of 2017. The guidance is lower than market watchers' estimates of...
Tuesday 25 July 2017
MediaTek to transfer 28nm chip orders to UMC
MediaTek plans to transfer part of its 28nm mobile chip orders, including those for the Amazon Echo Dot, to United Microelectronics (UMC) from Taiwan Semiconductor Manufacturing Company...
Monday 24 July 2017
Chip demand from non-Apple camp slows
Chip suppliers engaged in Apple's supply chain started to see orders pick up in June. On the other hand, chip demand from the non-Apple camp has been slow, according to sources at...
Tuesday 18 July 2017
TSMC expanding number of equipment suppliers for 7nm
Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according...
Friday 14 July 2017
Faraday unveils 28HPC USB 3.1 PHY and 40LP Type-C PHY with PD controller
Faraday Technology, a Taiwan-based ASIC design service and IP provider, has announced the availability of its USB 3.1 PHY on UMC 28HPC process, as well as the silicon-verified USB...
Thursday 13 July 2017
TSMC 2Q17 EPS hits 5-quarter low
Taiwan Semiconductor Manufacturing Company (TSMC) has reported net profits of NT$66.27 billion (US$2.18 billion) on consolidated revenues of NT$213.86 billion for the second quarter...
Monday 10 July 2017
Globalfoundries 22FDX attracts orders from Shanghai Fudan
Globalfoundries' 22nm FD-SOI process, dubbed 22FDX, has obtained orders from Shanghai Fudan Microelectronics, according to industry sources.
Tuesday 27 June 2017
MediaTek shifts half of its 16nm chip orders away from TSMC, says report
Half of MediaTek's 16nm chip orders placed with Taiwan Semiconductor Manufacturing Company (TSMC) will be shifted to Globalfoundries, according to a report from Taiwan's TechNe...
Monday 26 June 2017
SMIC mass producing 28nm HKMG chips
Semiconductor Manufacturing International's (SMIC) 28nm HKMG process has entered its mass production stage, according to company CEO Haijun Zhao. SMIC will move forward making chips...
Thursday 22 June 2017
Samsung mass producing Exynos-branded IoT solution
Samsung Electronics has announced the start of mass production of its first Exynos-branded IoT solution, the Exynos i T200.
Thursday 22 June 2017
Faraday MFP ASIC shipments rise at CAGR of 38%
Faraday Technology has announced that its MFP (Multi-Function Printer) ASIC solutions have surpassed 50 design wins since its introduction 10 years ago, and the MFP ASIC shipment...
Thursday 22 June 2017
Xiaomi sampling in-house developed Surge S2 chips, says report
Earlier in 2017, Xiaomi Technology unveiled its first in-house developed smartphone solution, dubbed Surge S1, which is built by Taiwan Semiconductor Manufacturing Company (TSMC)...
Monday 12 June 2017
Packaging can extend physical limits of semiconductors, says TSMC chair
Moore's Law will reach its physical limits in 8-10 years, but the development of advanced packaging technology will help extend innovations, according to Morris Chang, chairman of...
Friday 9 June 2017
Pure-play foundries post increased May revenues
Taiwan-based pure-play foundries Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) have reported sequential...
Saturday 3 June 2017
SMIC eyeing top-3 spot in pure-play foundry segment
Semiconductor Manufacturing International (SMIC) is aiming to become a global top-3 pure-play foundry chipmaker by 2020, according to the China-based company. In addition to advanced...