The 2024 China Computing Power Conference highlighted the ongoing challenges in China's AI computing capabilities. Experts emphasized the need to address China's computing power gap...
At the 2024 China Computing Power Conference, Xiao-hui Yu, President of the China Academy of Information and Communications Technology (CAICT), analyzed the newly released "China...
Google's innovative approach of using artificial intelligence to design AI chips is revolutionizing the semiconductor industry. The key to their AlphaChip system lies in its reinforcement...
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization...
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
Thermal management has become an increasingly critical issue as the computing performance of AI chips continues to advance. High temperatures not only lead to slower performance due...
RISC-V, according to Frankwell Lin, chairman of Andes Technology and chairperson of Taiwan's RISC-V Alliance, provides a variety of advantages, such as flexibility and openness, in...
Shanghai Enflame Technology, a Chinese AI chip company backed by Tencent, has recently filed its intention to IPO with the Shanghai Bureau of the China Securities Regulatory Commis...
The British semiconductor delegation, composed of 24 firms led by the UK Government's National Technology Adviser Dave Smith, has made its splash at SEMICON for the second year in...
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...
Major players in Nvidia's supply chain, such as global foundry leader TSMC, have good order visibility extending to 2026, despite stock investors' concern about the US chip vendor's...
AI chips required by generative AI rely on finely wired and processed equipment; thus, front-end process equipment manufacturers have shifted their focus to the advanced packaging...
Despite rumors of shipment delays for Nvidia's new-generation AI chips, the demand for AI servers remains strong. For contract manufacturers like Foxconn, the challenge lies in maximizing...
