Pure-play foundry TSMC will see its fab utilization rates, notably for sub-7nm process manufacturing, rise substantially in the second half of this year, according to sources at fab...

Large-size displays such as TVs have seen demand recover earlier than smaller ones for handset, notebook and other consumer electrics devices after becoming the first to enter inventory...

Heat spreaders have to be made bigger and thicker to support AI chips with a larger surface areas and higher performance, according to Jentech Precision Industrial president Chin-Lung...

AI chip market leader Nvidia is reportedly interested in testing SK Hynix's latest generation of high-bandwidth memory (HBM). If the two sides successfully collaborate, it will help...

The market for edge AI computing devices is poised to enter a period of expansion, according to sources at IC design houses.

TSMC has placed rush orders for CoWoS packaging equipment in order to meet surging demand for Nvidia's AI chips, according to sources at fab toolmakers.

TSMC is contemplating a 3 to 6 percent price increase for its advanced process manufacturing beginning in January 2024, according to sources at IC design houses. The price increases...

Advanced Semiconductor Engineering (ASE) has announced its latest fan-out-chip-on-substrate-bridge (FOCoS-Bridge) technology innovation, which involved qualifying a large 70x78mm...

Taiwan's leading IC substrate maker Unimicron Technology will invest NT$30 billion (US$981.03 million) to set up a new plant in Taiwan dedicated to production of IC substrates with...

A boost in demand for AI chips may help TSMC sustain its annual revenue increase this year, according to market observers.

Almost all of TSMC's top-10 customers have readied plans to adopt the foundry's 2nm GAA-FET (gate-all-around field-effect transistor) process technology, to be commercialized in 2025...

The ChatGPT-triggered AI hype has attracted many IC vendors. Startup firms say they are now feeling the pressure from major IC design houses, such as MediaTek, Novatek and Realtek,...

Nvidia has placed additional orders for AI chips that require TSMC's CoWoS (chip on wafer on substrate) packaging, according to industry sources.

With the rise of AI-generated content (AIGC) in 2023, major players in the tech sector are joining the ranks of AI chip manufacturing one after another. Not only are international...