Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...
Toshiba and Amkor Technology have both agreed to postpone discussions regarding the previously-announced proposed acquisition by Amkor of Toshiba's semiconductor assembly operations...
In view of increased outsourcing demand by IDM companies, IC packagers Advanced Semiconductor Engineering (ASE) and Amkor Technology has been expanding their operations to vie for...
Amkor Technology and Globalfoundries have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes, according to the companies...
The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...
IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...
Taiwan's Greatek Electronics, a packaging and testing house specializing in consumer ICs, has denied local media reports indicating that it will be acquired by Amkor Technology of...
Amkor Technology has said it plans to allocate a capex of US$100-125 million for the first quarter of 2010, a significant rise compared to US$69 million spent a year ago. The figure...
Amkor Technology has announced it expects revenues for the fourth quarter to grow by around 6% sequentially, attributing the better outlook to higher-than-expected customer demand...
Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...
Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...
Advanced Semiconductor Engineering (ASE) plans to increase wire-bond and bumping capacity, and Siliconware Precision Industries (SPIL) will expand its flip-chip (FC) ball-grid array...
Amkor Technology is expected to see the strongest revenue growth among top packaging and testing houses in th third quarter, followed by Advanced Semiconductor Engineering (ASE),...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have recently seen more orders shifted from Amkor Technology, STATS ChipPAC Taiwan Semiconductor...
Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...
