The Biden Administration has announced that the CHIPS and Science Act will subsidize US$400 million to help Amkor, the largest semiconductor packaging and testing company in the US,...
Amkor reported modest sales growth, primarily driven by surging demand for AI data centers and growth in the smartphone market. These positive factors offset declining sales in the...
Amkor Technology has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act, according...
Amkor Technology and Infineon Technologies have signed a Memorandum of Understanding (MoU) to jointly promote sustainability and decarbonization methods across their supply chain.
Amid the competition among SK Hynix and Samsung Electronics regarding HBMs, SK Hynix reportedly plans to team with Amkor to enter the interposer market to alleviate the interposer...
TSMC's advanced packaging CoWoS capacity continues to have strong demand. Even after doubling its capacity in 2024 and collaborating with OSAT companies, it can still not fully meet...
Infineon Technologies recently announced a multi-year partnership with Amkor Technology, a leading provider of semiconductor packaging and test services. Both companies have agreed...
According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
Amkor Technology and GlobalFoundries (GF) will officially kick off their strategic partnership in Europe with a ribbon-cutting ceremony held recently at Amkor's plant in Porto, Por...
With Amkor's official announcement of the construction of an advanced packaging facility in Arizona, an "alliance" consisting of TSMC, Apple, and Amkor is taking shape, posing a potential...
Amkor Technology has announced plans to construct an advanced packaging and test facility in Peoria, Arizona. Amkor expects to invest around US$2 billion and employ approximately...
Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
