News tagged Amkor at DIGITIMES

NEWS TAGGED AMKOR

Friday 22 May 2026

Amkor expands Arizona semiconductor packaging campus with additional 67 acres

Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through...

Thursday 30 April 2026

Amkor advances data center CPU mass production amid manageable supply and cost risks

Amkor, the world's second-largest OSAT provider, recently held its earnings call where CEO Kevin Engel highlighted strong demand for AI and high-performance computing (HPC) chips driving...

Tuesday 28 April 2026

Amkor records strong 1Q26, advanced packaging expected to triple YoY

Amkor Technology is off to a record start in 2026. First-quarter revenue hit US$1.68 billion, up 27% from the prior year, driven by record performance in AI data center applications...

Tuesday 28 April 2026

US chip packaging capacity to hit 10% by 2032

The Trump administration continues to push for reshoring the semiconductor industry to the US. As global foundry giants TSMC, Intel, and Samsung Electronics expand advanced manufacturing...

Tuesday 28 April 2026

Strong demand and advanced packaging execution drive Amkor's upbeat quarter

Amkor Technology reported a strong start to 2026, with management attributing the performance to robust demand across multiple end markets and continued execution in advanced packa...

Thursday 23 April 2026

TSMC to open Arizona packaging facility by 2029, signals caution on high-NA EUV

TSMC is accelerating its advanced packaging expansion in the US while maintaining a conservative stance on next-generation lithography, as the company balances cost pressures, AI-driven...

Thursday 16 April 2026

Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond

Introduction

Thursday 9 April 2026

Geopolitics and AI is redrawing the global chip packaging landscape

The AI computing boom is reshaping where semiconductors get packaged. Geopolitical pressure and supply chain diversification are pushing capacity well beyond its traditional strongholds...

Friday 6 March 2026

Amkor eyes triple revenue growth in 2.5D and HDFO packaging for 2026

Semiconductor OSAT leader Amkor has announced plans to boost its capital expenditure budget for 2026 to US$2.5-3 billion, prioritizing expansion of advanced packaging capacities such...

Thursday 12 February 2026

China claims five places in 2025 global OSAT top 10

The latest global ranking of the top 10 outsourced semiconductor assembly and test (OSAT) providers points to a shift in competitive balance. In 2025, five Chinese companies entered...

Tuesday 10 February 2026

Amkor pivots toward AI and HPC with ambition to expand advanced packaging

Amkor Technology is accelerating its transition into the next wave of advanced packaging growth, focusing on high-performance computing (HPC) and artificial intelligence (AI). This...

Tuesday 10 February 2026

Amkor accelerates US expansion with Arizona investment and closer alignment with TSMC

Amkor Technology is accelerating its global expansion, projecting 2026 capex between US$2.5 billion and US$3 billion. This plan emphasizes significant facility construction, including...

Tuesday 10 February 2026

Amkor posts strong 2025 results as advanced packaging drives growth, ramps up AI-focused investment

On February 9, Amkor Technology reported solid financial performance for both the fourth quarter and full year 2025, supported by record revenue from advanced packaging and computing...

Saturday 17 January 2026

Amkor to close longstanding Japan chip plant as EV demand slows

Amkor Technology, the US-based semiconductor packaging and testing company, said it will close its Hakodate plant in northern Japan by...

Monday 5 January 2026

TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung

As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...

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