Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other...
Apple is expected to significantly increase the adoption of IPD (integrated passive devices) for new iPhones and other iOS products, providing robust business opportunities for manufacturing...
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Taiwan's top OSAT company ASE Technology Holding has been stepping up its purchases of more automated wire-bonding packaging machines to expand capacity for clients, while also enhancing...
Qualcomm has been gearing up to seek multiple supply sources for both silicon-based and III-V semiconductors amid increasingly tight capacity at the global IC value chain, and reportedly...
ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...
ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...
ASE Technology reportedly has become Sony's second backend partner for processing automotive CMOS imaging sensors (CIS), marking its return to the CIS packaging segment following...
Leading foundry houses are mostly partners rather than competitors for OSAT firms despite their aggressive deployment in advanced 3D IC packaging solutions, according to Amkor Technology...
Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...
Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...
As TSMC plans to build a 5nm wafer fab in the US, how the company will handle backend support for the fab is drawing concerns from Taiwan's backend supply chain, and a possible solution...
It remains premature for Taiwan's IC substrate makers to expect AiP (antenna in package) substrate shipments for mmWave 5G smartphones to contribute positively to their revenues in...
Taiwan-based Universal Scientific Industrial (USI), a unit of ASE Technology, is likely to obtain system-in-package (SiP) orders for AirPods Pro Lite, which may also benefit Taiwanese...
