Amkor Technology and GlobalFoundries (GF) will officially kick off their strategic partnership in Europe with a ribbon-cutting ceremony held recently at Amkor's plant in Porto, Por...
With Amkor's official announcement of the construction of an advanced packaging facility in Arizona, an "alliance" consisting of TSMC, Apple, and Amkor is taking shape, posing a potential...
Amkor Technology has announced plans to construct an advanced packaging and test facility in Peoria, Arizona. Amkor expects to invest around US$2 billion and employ approximately...
Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
Chinese OSATs with support from government subsidies have reduced their prices further in an effort to secure more orders, whereas first-tier semiconductor backend services providers...
The AI trend is now a worldwide phenomenon, with Nvidia CEO Jensen Huang even declaring that "Nvidia is betting everything on AI." In 2023, the AI server supply chain became one of...
Amkor Technology is ramping up its capacity for advanced packaging production, with monthly output for 2.5D packaging expected to reach 5,000 wafers in the first half of 2024, up...
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...
In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
Nvidia CEO Jensen Huang's exclamation of the arrival of "AI's iPhone moment" sparked an explosive demand for AI HPC (high-performance computing) chips. For 2.5D advanced packaging...
ASE Technology (ASEH) and Amkor Technology, the world's top two OSATs, have both expanded production outside of China and Taiwan, according to industry sources.
Apple will reportedly have its own 5G modem chip, with OSATs such as the ASE Technology Holding (ASEH) and Amkor Technology competing for orders, according to market sources.
