Qualcomm has contracted both Amkor Technology and Siliconware Precision Industries (SPIL) to provide backend services for its just-unveiled flagship smartphone SoC, according to industry...
The semiconductor industry players are forming a regional cluster in Europe, with the support of EU's semiconductor initiative to decrease its dependence on Asia. Seeing growing demand...
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...
System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...
Ever-advancing datacenter, server, networking and AI applications continue to drive R&D momentum for diverse HPC chip solutions, and Arm-based HPC chips, in particular, have been...
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...
ASE Technology, which owns Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), is in preliminary talks with Apple for backend orders associated with...
Taiwan-based OSATs and IC test interface solution providers are upbeat about demand for new processors unveiled by vendors including AMD and Nvidia for the next couple of years, according...
Taiwan's leading backend house ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have obtained major orders for processing Qualcomm's just-unveiled flagship...
TSMC has outsourced part of its chip-on-wafer-on-substrate (CoWoS) packaging to OSATs including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and...
Qualcomm will sharply cut back its modem chip supply for Apple's iPhones starting 2023, sparking speculation that Apple will have its in-house developed modem solution ready for the...
As Qualcomm is actively expanding its presence in the GaAs-based handset PA segment, its partners in Taiwan including foundries Win Semiconductors and Advanced Wireless Semiconductor...
