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Thursday 14 April 2016
ASE grabs major SiP module orders for second-generation Apple Watch, sources say
Advanced Semiconductor Engineering (ASE), already a provider of SiP (system-in-package) modules for the first-generation Apple Watch, has reportedly grabbed the majority of SiP module...
Thursday 29 October 2015
Amkor posts revenue and profit decreases in 3Q15
Packaging and testing company Amkor Technology has announced net profits of US$28 million, or US$0.12 per share, on revenues of US$734 million for the third quarter ended September...
Thursday 3 September 2015
Amkor positive about consolidation within IC backend sector
The IC packaging and testing sector will continue its trend toward consolidation, and Amkor Technology is positive about such development, according to Mike Liang, president of Amkor...
Tuesday 25 August 2015
Commentary: ASE purchase of SPIL shares is positive
Plans by Advanced Semiconductor Engineering (ASE) to buy up to 25% of Siliconware Precision Industries (SPIL) for an amount likely exceeding NT$30 billion (US$919 million) may be...
Wednesday 3 September 2014
Demand of 3D ICs may not take off for 3 years, says Amkor Technology
Demand for 3D IC parts may not begin to take off until three years due to concerns of high production costs, according to Mike Liang, president of Amkor Technology Taiwan.
Monday 27 January 2014
Amkor, STATS ChipPAC and ASE to share backend orders for Apple A8 chip, say sources
Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken...
Tuesday 31 December 2013
IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...
Monday 25 November 2013
Amkor, Globalfoundries and Open-Silicon partner to develop SoC on 2.5D interposer
Amkor Technology, Globalfoundries and Open-Silicon have jointly announced the successful demonstration of a functional SoC featuring two 28nm logic chips with embedded ARM processors,...
Thursday 1 August 2013
Amkor completes acquisition of Toshiba packaging unit in Malaysia
IC assembly and test service provider Amkor Technology has completed its acquisition of Toshiba's semiconductor packaging operation in Malaysia, according to the two companies.
Tuesday 9 July 2013
High-end packaging next battlefield for IC assembly and test services providers, says Amkor executive
Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...
Friday 3 May 2013
Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner
The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.
Thursday 31 January 2013
Renesas, J-Devices sign MoU on transfer of backend facilities
Renesas Electronics and J-Devices have signed a memorandum of understanding regarding the transfer of three semiconductor backend production facilities operated by Renesas and its...
Monday 6 August 2012
Major IC packagers step up 2012 capex
Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set...
Monday 25 June 2012
ASE to expand operations in Korea
In view of the growing semiconductor industry in Korea, Advanced Semiconductor Engineering (ASE) is looking to expand its local factory site located in Paju, Gyeonggi Province, with...
Monday 2 April 2012
Amkor licenses proprietary through-mold-via technology to Shinko
Amkor Technology has announced that the company has granted Shinko Electric Industries a non-exclusive license to its proprietary through-mold-via (TMV) technology.