The world's first Android-based smartphone with 3D facial recognition technology is unlikely to hit the market until the third quarter of 2018 due to insufficient capability to integrate...
China-based handset brands have ramped up their chip orders since March with the demand momentum likely to continue into early May, according to sources from Taiwan's IC suppliers.
IC testing solution provider Chunghwa Precision Test Tech (CHPT) has reported consolidated revenues of NT$279 million (US$9.55 million) for March 2018, up 31.2% sequentially and 3.4%...
Smartphone vendors in the Android camp are rushing to incorporate in-display fingerprint recognition technology into their 18:9 all-screen models as they have turned conservative...
Most Android smartphone vendors, particularly those in China, are still reluctant to adopt 3D sensing technology for their new models to be launched in 2018 due to the persistent...
Himax Technologies has presented Android smartphone samples equipped with the company's 3D sensing total solution at the 2018 Mobile World Congress in Barcelona. The solution is ready...
At MWC 2018, Samsung launched the Galaxy S9 and S9 Plus with an evolutionary design building on Galaxy S8 and S8 Plus. Samsung is focusing on enhanced camera capabilities to differentiate...
Taiwan-based IC design houses expect orders from China's smartphone industry to pick up in the second quarter of 2018, with customer orders likely to register double-digit sequential...
Mobile DRAM contract prices will rise a mere 3% sequentially in the first quarter of 2018, according to DRAMeXchange. Despite the recent launch of new full-screen smartphones, consumers...
Taiwan-based IC packager Xintec is expected to enjoy significant 3D sensing business opportunities from both iPhone and Android-based smartphone camps in 2018 in its capacity as a...
Not many Android-based smartphones launched in the first half of 2018 will come with 3D sensing technology due to technological and cost barriers, according to industry sources.
Android smartphone vendors including Huawei, Oppo and Xiaomi Technology are expected to equip 3D sensing functionality to their new models slated for launch in 2018, according to...
As wireless charging is set to gain popularity following the adoption of Qi wireless charging standard of the Wireless Power Consortium (WPC) by both the latest iPhone devices and...
Fabless IC firm Himax Technologies has begun shipments of chips based on wafer-level optics (WLO) technology to Apple, according to industry sources. The solution is reportedly a...
