Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from...
Taiwan IC analysis and inspection labs are expected to see demand from US chipmakers and Huawei/HiSilicon weaken in the second half of the year on uncertainties arising from the coronavirus...
Taiwan's backend leader ASE Technology is poised to apply its SESUB (semiconductor embedded in substrate)-based SiP packaging technology to next-generation TWS (true wireless stereo)...
Taiwan-based niche-type CCL maker Ventec International has reported its net profit surged 53.2% from a year earlier to NT$107 million (US$3.58 million) in the first quarter of 2020...
PCB maker Dynamic Electronics expects demand to follow seasonal patterns in the second half of 2020, with stable ramp-up in shipments of high-end boards for automotive, server and...
Flexbile PCB maker Flexium Interconnect expects its shipments of MPI (modified polyimide) high-frequency antenna modules to non-handset segments to ramp up as a new growth driver...
TSMC has landed additional InFO (integrated fan-out) packaging orders requiring short lead times from MediaTek's Nephos, according to industry sources.
Dongshan Precision Manufacturing (DSBJ) saw its net earnings for 2019 drop 13.37% on year to CNY703 million (US$99.38 million) despite revenues surging 18.8% to CNY23.553 billion,...
High-frequency and high-speed flexible PCBs are emerging as indispensable components for antenna transmission modules for hand-held devices, IoT networking equipment and automotive...
Shipments of voice coil motors (VCMs) used in camera modules for Apple's upcoming 5G iPhones are likely to see a slowdown around the middle or the latter half of the second quarter,...
Flexible copper-clad laminate (FCCL) supplier Taiflex Scientific is building a new plant in Nantong, China's Jiangsu province, to produce high-frequency, high-speed FCCL materials...
As mmWave 5G phone market will see limited development momentum in 2020, shipments of flexible LCP (liquid crystal polymer) antenna boards for mmWave 5G smartphones are expected to...
It remains premature for Taiwan's IC substrate makers to expect AiP (antenna in package) substrate shipments for mmWave 5G smartphones to contribute positively to their revenues in...
Taiwan's IC testing and certification service labs have seen orders from the non-Apple camp ramp up drastically for inspecting and analyzing HPC chips demanding advanced-node manufacturing,...
The use of smart antenna technology is an effective way to reduce interference, boost system capacity, increase data rate and optimize link quality of wireless communication devices...
