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Thursday 5 March 2015
Global Unichip utilizes Cadence analog IP to implement WiGig-enabled SoC on 28nm process
Cadence Design Systems has announced that Global Unichip achieved first-silicon success integrating tri-band analog front-end (AFE) intellectual property (IP) with WiGig (IEEE 802.11ad),...
Wednesday 21 January 2015
UMC and Cadence collaborate to deliver 28nm design reference flow for ARM Cortex-A7 MPCore-based SoC
Cadence Design Systems has announced that United Microelectronics (UMC) used its implementation and signoff tools to produce a silicon-ready 28nm ARM Cortex-A7 MPCore-based System-on-Chip...
Thursday 18 December 2014
Globalfoundries and Cadence deliver first SoC enablement solution featuring ARM Cortex-A17 processor in 28nm-SLP process
Cadence Design Systems and Globalfoundries have jointly announced the delivery of quad-core silicon built around the ARM Cortex-A17 processor implemented using Globlfoundries' 28nm...
Tuesday 2 December 2014
HiSilicon expands adoption of Cadence tools and IP for advanced-node FinFET designs
Cadence Design Systems announced on December 1 that HiSilicon Technologies has signed an agreement to significantly expand its use of the Cadence digital and custom/analog flows for...
Wednesday 23 October 2013
VIA licenses Cadence Tensilica HiFi audio/voice DSP
Cadence Design Systems has announced that VIA Technologies has selected the Cadence Tensilica HiFi audio/voice digital signal processor for a system-on-chip design for set-top boxes,...
Wednesday 4 September 2013
ARM buys mobile display IC cores from Cadence
Processor IP licensor ARM and Cadence Design Systems, an EDA tool company, have signed an agreement for the sale and transfer of Cadence PANTA display controller cores to ARM, according...
Friday 28 June 2013
Blue-collar processing: Q&A with Tensilica founder Chris Rowen
Based in Santa Clara, Tensilica has been around the semiconductor industry for around 15 years, providing customers with what it calls configurable dataplane processors (DPUs). The...
Thursday 19 April 2012
20nm process to take off in 2013, says Cadence executive
The semiconductor industry will accelerate towards the adoption of 28nm process in 2012, and begin its transition to the next technology node in 2013, according to Chi-Ping Hsu, a...
Tuesday 30 August 2011
Globalfoundries tapes out 20nm test chip
Globalfoundries has announced that it successfully taped out a 20nm test chip using flows from EDA partners Cadence Design Systems, Magma Design Automation, Mentor Graphics and Synopsys...
Wednesday 13 July 2011
Samsung Foundry tapes out 20nm
Samsung Electronics has announced that its foundry business, Samsung Foundry, successfully taped-out a test chip based on its 20nm process with high-k metal gate (HKMG) technology...
Thursday 8 April 2010
TSMC delivers interoperable EDA formats for advanced process technologies
Taiwan Semiconductor Manufacturing Company (TSMC) has made available several unified and interoperable electronic design automation (EDA) technology files for its 65nm, 40nm and 28nm...
Monday 13 July 2009
EDA providers reshuffle management in Asia Pacific
Another electronic design automation (EDA) provider is reshuffling its Asia-Pacific operations, following recent regional head changes at Cadence Design Systems and Synopsys, according...
Tuesday 30 June 2009
Global Unichip to have former Cadence Asia Pacific president head China operations
Taiwan-based IC design service provider Global Unichip has decided to appoint Lung Chu, the former Asia Pacific president for EDS company Cadence Design Systems, as its China president...
Thursday 4 June 2009
Global Unichip beefing up presence in China, Japan and South Korea
Taiwan IC design service provider Global Unichip will strengthen its deployments in China, South Korea, Japan, Europe and Israel in 2009, according to company CEO KC Shih. Market...
Friday 13 March 2009
SiS joins power forward initiative to assist in delivering power-efficient computing platforms
Silicon Integrated System (SiS) has announced its joining of the Power Forward Initiative (PFI) and plans to offer common power format (CPF) design solutions for its chipset, motherboard,...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research