Cadence Design Systems has announced that Realtek Semiconductor used the Cadence Innovus implementation system for its 28nm Digital TV (DTV) system-on-chip (SoC) production tapeout...

Advanced Semiconductor Engineering (ASE) and Cadence Design Systems have collaborated to release a system-in-package (SiP) EDA solution that addresses the challenges of designing...

Cadence Design Systems has announced that HiSilicon, a global fabless semiconductor and IC design company, has selected the Cadence Tensilica Vision P6 DSP for its 10nm Kirin 970...

Xilinx, ARM, Cadence Design Systems and TSMC have announced a collaboration to build the first CCIX (cache coherent interconnect for accelerators) test chip in TSMC 7nm FinFET process...

ASML has landed a pull-in of EUV lithography equipment orders with its backlog reaching 21 units, according to the company.

Cadence Design Systems has announced that its complete suite of digital and signoff tools has been certified for Samsung Electronics' Process Design Kit (PDK) and Foundation Library...

Cadence Design Systems, has announced that Fujitsu has adopted the Cadence Palladium Z1 enterprise emulation platform for the development of the ARMv8-based Post-K computer. The Post-K...

Cadence Design Systems has announced several important deliveries in its collaboration with TSMC to advance 7nm FinFET designs for mobile and high-performance computing (HPC) platf...

Cadence Design Systems has announced the immediate availability of an integrated system design solution for TSMC's advanced wafer-level integrated fan-out (InFO) packaging technology,...

Cadence Design Systems has announced the availability of a Cadence Rapid Adoption Kit (RAK) for the new ARM Cortex-R52 CPU, which targets complex embedded designs for safety applications...

Micron Technology has announced its newest embedded SLC NAND flash optimized for the next generation of Internet of Things (IoT) and automotive applications. Available with differing...

Cadence Design Systems has announced that its implementation and signoff tools have been certified on the Intel third-generation 10nm tri-gate process for customers of Intel Custom...

Cadence Design Systems has announced the availability of a Rapid Adoption Kit (RAK) based on the ARM internal flow used for the design of the ARM Cortex-A73 central processing unit...

Cypress Semiconductor has selected the full Cadence RTL-to-signoff digital design flow and complete Spectre circuit simulation platform for all of its 40nm automotive chip designs,...

Toshiba has adopted the Cadence Innovus implementation system for its memory controller's production design project, according to the EDA company. The tool enabled Toshiba...