Micron Technology has announced the sampling of its next-generation GDDR7 graphics memory, which it says boasts the industry's highest bit density for AI, gaming, and high-performance...
The use of Generative AI (GenAI) with Electronic Design Automation (EDA) tools to expedite the design process has emerged as a new trend, according to Cadence Design Systems.
As the US-China technology war enters its seventh year, with the process of domestic substitution policy of China's semiconductor industry continuing to deepen, China's local Electronic...
To drive the technologies and products of the future, creative companies rely on end-to-end solutions across chips, IPs, packages, PCBs, and systems to meet strict design requirements...
Cadence, one of the global EDA giants, expressed optimism for India-based IC design houses to differentiate themselves from global fabless semiconductor firms by designing chips for...
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
In alignment with trends across various sectors, semiconductor firms are vigorously exploring AI-powered solutions to refine operations and boost productivity. A notable development...
Professor Alberto Sangiovanni-Vincentelli is a legend of the electronic design automation (EDA) industry, but his stories were seldom told. DIGITIMES Asia is privileged to have this...
3D IC technology has emerged as a significant advancement in the semiconductor industry. Despite its significance, there are still a number of unresolved issues and challenges that...
Cadence Design Systems and Rambus, a premier chip and silicon IP provider making data faster and safer, today announced that they have entered into a definitive agreement for Cadence...
According to Intel, Boeing and Northrop Grumman have joined phase two of the Department of Defense's RAMP-C program, which aims to facilitate a leading-edge US foundry ecosystem on...
Samsung Electronics has disclosed its latest advanced process development roadmap at the just-ended 2023 Samsung Foundry Forum, with plans to mass produce 2nm chips by 2025 and commercialize...
