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Wednesday 19 July 2023
RAMP-C program on Intel 18A adds 2 strategic defense industrial base customers
According to Intel, Boeing and Northrop Grumman have joined phase two of the Department of Defense's RAMP-C program, which aims to facilitate a leading-edge US foundry ecosystem on...
Monday 3 July 2023
Samsung set to commercialize 2nm chips in 2025, 1.4nm by 2027
Samsung Electronics has disclosed its latest advanced process development roadmap at the just-ended 2023 Samsung Foundry Forum, with plans to mass produce 2nm chips by 2025 and commercialize...
Friday 30 June 2023
AI in chip design: Where does Cadence stand?
The global AI market is expanding at a rapid and unprecedented pace, transforming the semiconductor industry at the same time. As the demand for high-performance chips increases with...
Monday 5 June 2023
Cadence and Saigon High-Tech Park collaborate to nurture next generation of IC design expertise in Vietnam
Cadence Design Systems, Inc. (Nasdaq: CDNS) and Saigon High-Tech Park (SHTP), the leading high-tech hub in Vietnam, today announced a collaboration to foster electronic design expertise...
Monday 13 February 2023
Samsung, SK Hynix eyeing CXL memory solutions for auto applications
Major memory suppliers Samsung Electronics and SK Hynix reportedly are gearing up to develop CXL (compute express link)-based memory solutions, and the integration of CXL technology...
Wednesday 1 February 2023
UMC, Cadence collaborate on 3D-IC hybrid bonding reference flow
United Microelectronics (UMC) and Cadence Design Systems have jointly announced that the Cadence 3D-IC reference flow has been certified for UMC's chip stacking technologies.
Thursday 24 November 2022
AI-based EDA tools increasingly crucial for IC design process
With the increasing diversity of end-use applications, IC design houses are facing increasing challenges in product design, and how to shorten the time to market for new products...
Tuesday 6 September 2022
Chinese foundries brace for further sanctions, but EDA industry remains unprepared
Former US president Donald Trump successfully prevented ASML from shipping its EUV lithography machines to China in 2019, and talks of further extending the ban to DUV machines have...
Thursday 25 August 2022
Cadence, UMC team up for 22nm analog and mixed-signal IC design flow certification
Cadence Design Systems' analog and mixed-signal (AMS) IC design flow has been certified for United Microelectronics' (UMC) 22ULP/ULL process technologies, according to the companies...
Monday 15 August 2022
Intel elects Tan Lip-Bu as board director to assist IDM2.0 transformation
Intel Corporation has announced that Tan Lip‑Bu, the 2022 recipient of a prestigious award from the Semiconductor Industry Association (SIA), will join the company's board of...
Tuesday 8 March 2022
GF announces next-gen silicon photonics solutions
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Tuesday 30 November 2021
3D-IC can ease the ongoing global chip shortage concerns: Interview with Cadence
The technological benefits that the 3D stacking of integrated circuits brings have the potential to ease the current chip shortage concerns, according to Cadence Design Systems. As...
Friday 26 November 2021
EDAs to play crucial role in upcoming 3D IC era
Going beyond Moore's Law has become an important force driving advanced semiconductor technology. Top companies such as TSMC, Samsung Electronics and Intel are all already seeing...
Thursday 10 December 2020
China gearing up for homegrown EDA solutions
China is stepping up the development of homegrown EDA (electronic design automation) software and systems as part of its efforts to boost self-sufficiency in semiconductor, and many...
Friday 24 July 2020
Cadence and UMC certify mmWave reference flow on 28HPC+ process for advanced RF designs
Cadence Design Systems and United Microelectronics (UMC) have jointly announced that the Cadence millimeter wave (mmWave) reference flow has achieved certification for UMC's 28HPC+...