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Friday 15 November 2019
ShunSin to ramp up capex in 2020 for SiP capacity expansion
ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, will be ramping up its capex next year to better meet growing demand for packaging high-speed fiber-optic...
Friday 15 November 2019
Tong Hsing sees CIS packaging as major growth driver for 2020
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors and other niche ICs, expects its 2020 revenues to hit a new high on...
Thursday 14 November 2019
TSMC to build advanced packaging fab in northern Taiwan in 2020
TSMC's planned advanced packaging plant in Miaoli, Northern Taiwan has passed environmental impact assessment, enabling the foundry house to kick off construction of the new fab in...
Wednesday 13 November 2019
PCB maker Zhen Ding plans record capex for 2020
Taiwan's top PCB maker Zhen Ding Technology (ZDT) will budget a record high capex for 2020 and expects its revenues for the year to grow significantly from 2019 on stronger shipments...
Wednesday 13 November 2019
TSMC board approves US$6.6 billion for advanced process capacity
The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of about US$6.62 billion for the construction of new fab facilities, installation...
Friday 8 November 2019
Pegatron mulling more production in Southeast Asia
Pegatron will not rule out setting up new factory sites in Vietnam and India to satisfy customer demand, according to company president and CEO SJ Liao.
Wednesday 6 November 2019
Top 5 share of semi industry capex to set new record in 2019
The share of semiconductor industry capital spending held by the top-5 companies (Samsung, Intel, TSMC, SK Hynix and Micron) is forecast to reach an all-time high of 68% this year,...
Wednesday 6 November 2019
Taiwan backend firms expanding testing capacities for 5G chipsets
Taiwan's backend specialists ASE Technology, Powertech Technology (PTI), King Yuan Electronics (KYEC) and Sigurd Microelectronics are all moving to ready additional capacities to...
Monday 4 November 2019
Some flat panel makers in Korea, Taiwan to slash capex for 2019
Some flat panel makers in Korea and Taiwan, notably LG Display, AU Optronics (AUO) and Innolux, are cutting their capex for 2019 as they seek to improve their bottom lines in the...
Friday 1 November 2019
Samsung reportedly to step up capacity expansion pace
Samsung Electronics is reportedly looking to place new equipment orders for its memory fabs in Pyeongtaek (South Korea) and Xian (China), gearing up to resume its aggressive capacity...
Friday 1 November 2019
VIS stays cautious
Vanguard International Semiconductor (VIS) remains cautious about its outlook for the rest of 2019, citing still high inventory levels at its customers, according to the Taiwan-based...
Thursday 31 October 2019
ASE eyes bright 1Q20 amid strong 5G-driven backend demand
IC backend house ASE Technology Holding expects to enjoy a better-than-regular performance for the first quarter of 2020 thanks to strong high-end chips packaging orders for 5G phones,...
Tuesday 29 October 2019
ABF substrate supply may fall short of 5G-driven demand in 2020
ABF substrate demand will stay robust throughout 2020 and beyond thanks to a diversity of applications arising with the advent of the 5G era, according to Jiang Xugao, a PCB expert...
Monday 28 October 2019
Gudeng, Marketech enjoy strong orders for EUV tools
Taiwan-based Gudeng Precision and Marketech International, which provide ASML equipment parts and components, are being identified as some of the beneficiaries of TSMC's capex ramp-up...
Friday 18 October 2019
Robust 7nm and 5nm chip demand to drive TSMC 2020 growth
TSMC is set to enjoy another year of record-high sales in 2019, but net profits are unlikely to break the record high set last year due mainly to disappointing results during the...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research