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NEWS TAGGED CAPEX
Wednesday 5 August 2009
Elpida ASP up 27% in fiscal 1Q09
Japan's Elpida Memory has announced a net loss of 44.4 billion yen (US$470 million) for the quarter ended June 30, 2009, compared to a loss of 60.9 billion yen in the prior quarter...
Tuesday 4 August 2009
Taiwan passive component makers to expand capacity
Thinking Electronic and Ralec Electronic both have plans to expand capacity by adding equipment, while Ta-I Technology will spend NT$80 million (US$2.45 million) to make more protective...
Tuesday 4 August 2009
Taiwan quartz device makers to expand capacity
Taiwan quartz component maker TXC will procure equipment to develop more products, while fellow maker Tai-Saw Technology (TST) will add equipment to expand its production capacity...
Tuesday 4 August 2009
Equipment makers gearing up for customer expansion projects
With foundries, IC backend houses and panel makers revising upward their 2009 capex, Taiwan-based semiconductor and LCD equipment makers are gearing up for an expected uptick in orders...
Tuesday 4 August 2009
Top semiconductor suppliers sales surge 21% in 2Q09, says IC Insights
The top-20 semiconductor companies, in total, registered a second-quarter 2009 sales increase of 21%. This was a 37-point swing compared to the first-quarter results when the same...
Monday 3 August 2009
ASE, SPIL to expand high-end process capacity
Advanced Semiconductor Engineering (ASE) plans to increase wire-bond and bumping capacity, and Siliconware Precision Industries (SPIL) will expand its flip-chip (FC) ball-grid array...
Friday 31 July 2009
ASE swings to profits in 2Q09; raises capex
Advanced Semiconductor Engineering (ASE) swung back to profitability in the second quarter of 2009. The world's top IC packaging house has also delivered an optimistic outlook for...
Friday 31 July 2009
Memory backend house PTI upbeat about 3Q09; raises capex
Powertech Technology (PTI) has increased its 2009 capex to NT$5 billion (US$151.97 million) to fund new backend equipment purchases, revising its original plan of NT$3 billion, according...
Friday 31 July 2009
TSMC CEO claims improved 40nm yield, predicts better 3Q09
Taiwan Semiconductor Manufacturing Company (TSMC) has issued positive guidance for the third quarter of 2009, following its improved second-quarter earnings that underline the chip...
Thursday 30 July 2009
TSMC shipments more than double in 2Q09; ups capex for 2009
Taiwan Semiconductor Manufacturing Company (TSMC) posted consolidated revenues of NT$74.21 billion for the second quarter, up 87.9% from NT$39.5 billion in the first. On an annual...
Thursday 30 July 2009
SPIL chairman anticipates rising demand from emerging markets in 3Q09
Following a better-than-expected second quarter financial report, IC packaging and testing firm Siliconware Precision...
Wednesday 29 July 2009
UMC swings to profit in 2Q09; ups capex for 2009
United Microelectronics Corporation (UMC) swung back to profitability in the quarter ended June 30, 2009, and saw revenues for the second quarter double compared to the prior quarter...
Wednesday 29 July 2009
Unimicron 2Q09 performance beats estimates
PCB and substrate player Unimicron Technology has reported a net profit of NT$1.12 billion (US$34.26 million) for the second-quarter, translating into an EPS of NT$0.96, and beating...
Friday 24 July 2009
KYEC revises capex plan for 2009 on demand for 12-inch wafers
King Yuan Electronics Company (KYEC) on July 23 announced its board of directors has approved plans to raise its capex budget to NT$1.6 billion (US$48.68 million) for 2009, a 60%...
Friday 24 July 2009
UMC gearing up for 40nm
United Microelectronics Corporation (UMC) has been working closely with customers, including FPGA specialist Xilinx, to volume produce 45/40nm products at its 300mm (12-inch) fabs,...