Co-Tech Copper Foil, which supplies copper foil used to manufacture CCLs and PCBs, saw its August shipments rise by about 300 tons sequentially buoying company revenues for the month,...

Capacity expansions at China-based copper foil suppliers might cause an oversupply in the market in 2014, according to market sources.

Copper foil maker Co-Tech Copper Foil has reported revenues of NT$279 million (US$9.32 million) for July, up 2.8% sequentially but down 33.7% on year. For the first seven months,...

Co-Tech Copper Foil, which supplies copper foil used to manufacture CCLs and PCBs, now expects its sales ratio between the first and second halves of 2013 to be 50:50. The firm previously...

Co-Tech Copper Foil has reported consolidated revenues of NT$270 million (US$8.9 million) for June, down 37.6% sequentially but up 17.4% on year. For the first half of 2013, revenues...

Co-Tech Copper Foil, which supplies copper foil used to manufacture CCLs and PCBs, is striving to keep its quotes stable in the third quarter of 2013 amid falling copper prices and...

IC backend service company Advanced Semiconductor Engineering (ASE) has seen its Europe- and US-based fabless clients adopting copper wire to package their products since the beginning...

Consolidated revenues at Taiwan-based Co-Tech Copper Foil registered a 23.34% sequential rise in May 2013 hitting the highest monthly level in one year.

Taiwan-based rigid and flexible PCB makers have reduced CCL (copper-clad laminate) procurement temporarily due to expected price drops arising from continual decreases in international...

Taiwan-based Co-Tech Copper Foil saw its March revenues slip 12.3% on month and 33.7% on year to a 9-month low at NT$321 million (US$10.72 million). For the first quarter of 2013,...

Co-Tech Copper Foil, which supplies copper foil used to manufacture CCLs and PCBs, expects to return to profitability during the second half of 2013.

Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising...

United Microelectronics (UMC) has developed a thick-plated copper process, in collaboration with packaging house Chipbond Technology, for power management IC applications.

Quotes for copper foil have stayed at US$2.80/kg recently compared to US$2.50/kg in the fourth quarter of 2012, thanks to limited capacity ramps by makers, according to industry so...