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NEWS TAGGED COPPER
Monday 10 June 2013
Copper foil maker Co-Tech May sales rise
Consolidated revenues at Taiwan-based Co-Tech Copper Foil registered a 23.34% sequential rise in May 2013 hitting the highest monthly level in one year.
Wednesday 24 April 2013
PCB makers likely to ask for CCL price cuts on copper price falls
Taiwan-based rigid and flexible PCB makers have reduced CCL (copper-clad laminate) procurement temporarily due to expected price drops arising from continual decreases in international...
Monday 8 April 2013
Copper foil maker Co-Tech March revenues hit 9-month low
Taiwan-based Co-Tech Copper Foil saw its March revenues slip 12.3% on month and 33.7% on year to a 9-month low at NT$321 million (US$10.72 million). For the first quarter of 2013,...
Thursday 14 March 2013
Co-Tech looks for return to profitability in 2H13
Co-Tech Copper Foil, which supplies copper foil used to manufacture CCLs and PCBs, expects to return to profitability during the second half of 2013.
Wednesday 13 March 2013
Greatek looks to improved profitability on copper wire bonding lines
Logic IC packaging firm Greatek Electronics has revealed that copper wire bonding packaging lines are currently contributing more than 50% to its total revenues, which will further...
Thursday 31 January 2013
ASE, SPIL to stop ramping copper wirebonding capacity
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising...
Thursday 17 January 2013
UMC rolls out thick-plated copper process for PWM ICs
United Microelectronics (UMC) has developed a thick-plated copper process, in collaboration with packaging house Chipbond Technology, for power management IC applications.
Wednesday 16 January 2013
Copper foil prices up in January
Quotes for copper foil have stayed at US$2.80/kg recently compared to US$2.50/kg in the fourth quarter of 2012, thanks to limited capacity ramps by makers, according to industry so...
Thursday 3 January 2013
CCL maker EMC to expand capacity at China plant
Copper clad-laminate (CCL) maker Elite Material (EMC) has unveiled plans to invest CNY160 million (US$25.7 million) to expand capacity at its plant in Zhongshan (Guangdong province,...
Wednesday 12 September 2012
Demand for copper wirebonding machines to slide 50% sequentially in 4Q12
Demand for copper wirebonding machines from IC backend service companies is expected to decline 50% in the fourth quarter of 2012 as compared to purchases in the third quarter, according...
Thursday 6 September 2012
Demand for copper wirebonding packaging to peak in 2014
Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according...
Monday 3 September 2012
Taiwan copper wirebonding production value to rise
The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.
Wednesday 15 August 2012
Co-Tech becomes first Taiwan-based maker of FCCL-use copper foil
Co-Tech Copper Foil has extended production of electrolytic copper foil to thin foil for use in FCCLs (flexible copper-clad laminates), becoming the first Taiwan-based maker of such...
Tuesday 7 August 2012
Copper foil prices rebound
Having fallen over recent months, prices for copper foil stopped falling in August to reflect a rebound in copper prices, according to Taiwan-based Co-Tech Copper Foil.
Tuesday 31 July 2012
ASE, SPIL make progress in transition to copper wire bonding
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...
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