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NEWS TAGGED COPPER
Thursday 6 September 2012
Demand for copper wirebonding packaging to peak in 2014
Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according...
Monday 3 September 2012
Taiwan copper wirebonding production value to rise
The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.
Wednesday 15 August 2012
Co-Tech becomes first Taiwan-based maker of FCCL-use copper foil
Co-Tech Copper Foil has extended production of electrolytic copper foil to thin foil for use in FCCLs (flexible copper-clad laminates), becoming the first Taiwan-based maker of such...
Tuesday 7 August 2012
Copper foil prices rebound
Having fallen over recent months, prices for copper foil stopped falling in August to reflect a rebound in copper prices, according to Taiwan-based Co-Tech Copper Foil.
Tuesday 31 July 2012
ASE, SPIL make progress in transition to copper wire bonding
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...
Friday 29 June 2012
Greatek remains focused on shift to copper wire bonding
IC backend service provider Greatek Electronics, which focuses on the consumer electronics market, has said the firm will continue shifting copper wire bonding from gold bonding in...
Thursday 22 March 2012
First-tier motherboard makers drop 7 series motherboard prices
First-tier motherboard makers have recently dropped their Intel 7 series motherboard prices to compete for market share, although Intel has not yet officially announced the chipset,...
Wednesday 14 December 2011
Co-Tech hikes copper foil prices
Taiwan-based copper foil maker Co-Tech Copper Foil has decided to raise quotes for its products by US$0.2-0.3/kg in December as compared to the levels in November, according to the...
Tuesday 29 November 2011
Copper pillar bump penetration of FC packaging to rise
Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...
Monday 21 November 2011
Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon
Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...
Friday 11 November 2011
CCL supplier Doosan ramps China plant
Korea-based Doosan, a producer of copper clad laminates (CCL), has begun small-volume production at its new plant in Changshu, China. Monthly capacity at the facility is scheduled...
Friday 4 November 2011
ShineMore gearing up for niche-market CCLs
ShineMore Technology Materials, a maker of copper clad laminates (CCL), has revealed plans to grow the ratio of niche-market products in company revenues to 50% in 2012 from 27% estimated...
Friday 14 October 2011
Copper foil firms cutting back production
Copper foil manufacturers have moved to scale back their output by 30-40% as orders plummet to low levels, according to industry sources. The previous cutback took place in 2008,...
Wednesday 28 September 2011
Copper foil makers cut quotes for October; may press down CCL prices
In line with declining global copper prices, quotes for copper foils from Taiwan makers will drop by 3% on average sequentially in October, the third month in a row that the makers...
Friday 9 September 2011
FCCL maker Thinflex looks to improving utilization rates
Taiwan-based Thinflex, a supplier of flexible copper clad laminates (FCCLs), expects utilization rates at its plants in China and Taiwan will rebound to 70% in the third quarter of...