Quotes for copper foils and fiber glass fabrics, key raw materials for the production of PCBs, are expected to remain unchanged in July after a slide of 3-5% on average in June although...
Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...
Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...
IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...
Quotes for copper foils and fiber glass fabrics, key raw materials for the production of PCBs, have slid by 3-5% on average in June 2011 amid weakening demand and falling global commodity...
Taiwan-based CCL (copper-clad laminate) makers have lowered their quotes by 10% on average recently because of dropping international copper prices and bleak order prospects, according...
STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100...
Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph...
Prices for fiber glass fabrics in May 2011 will rise at a slower rate compared to 5-10% increases in April as producers of copper clad laminates (CCL) have been reluctant to place...
Prices for fiber glass fabrics, which are used for making copper clad laminates (CCL), are set to increase by 5-10% in April 2011, according to industry sources. Mainstream 7628-size...
With more fabless IC firms adopting copper wire to package their products for cost reasons, packaging and testing house Siliconware Precision Industries (SPIL) has seen a substantial...
LCD driver-IC packaging and testing firm Chipbond Technology and King Yuan Electronics (KYEC), which specializes in chip probing and final test services, have signed a memorandum...
Prices for copper foil, a raw material for making copper clad laminates (CCL), will be adjusted upward again in March, the Chinese-language Commercial Times cited industry...
Taiwan-based makers of notebook components such as connector, cable, power supply and cooling modules are seeing their profitability drop as the recent global copper price is hovering...
As London Metal Exchange (LME) spot quotes for copper are expected to steadily climb to a new record level of nearly US$10,000 per metric ton after the Lunar New Year, sources from...
