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NEWS TAGGED COPPER
Wednesday 22 December 2010
Co-Tech lowers copper foil quotes by 5% in December 2010
With copper prices continuing to trend up, copper foil quotes have increased 5% in December 2010, according to copper foil maker Co-Tech. Copper foil quotes from November 21 to December...
Thursday 16 December 2010
STATS ChipPAC, Intersil qualify copper wire interconnect for analog and mixed-signal devices
STATS ChipPAC and Intersil have qualified the use of copper wire interconnect solutions on a number of high-end analog and mixed-signal devices which are in volume production, STATS...
Friday 10 December 2010
Copper foil prices up another 5%
Quotes for copper foil have risen for the fourth consecutive month, up by 5% in December 2010 compared with November, according to industry sources. The upward trend reflects strengthening...
Wednesday 8 December 2010
Gold price increase spurs adoption of copper-wire bonding
With gold futures climbing to an historical high and copper prices relatively stable, IC packaging houses could see their gross margins eroded. The price difference between gold-wire...
Wednesday 24 November 2010
ASE grabs copper wirebonding orders from second-tier players
With Silicon Precision Industries (SPIL) quickly catching up with Advanced Semiconductor Engineering (ASE) in copper wirebonding, ASE is currently attempting to win orders over second-tier...
Tuesday 9 November 2010
CCL makers post mixed results for October
CCL (copper clad laminate) maker Iteq has registered NT$1.67 billion (US$55.3 million) in October consolidated revenues, up 1.8% from September. Fellow company Elite Materials (EMC)...
Friday 5 November 2010
Co-Tech October revenues down 11.5% on-month
Copper foil maker Co-Tech has posted revenues of NT$478 million (US$15.8 million) for October 2010, down 11.5% sequentially. But revenues were up 30% from a year ago.
Thursday 4 November 2010
Prices for copper foil up 5% in November
Prices for copper foil, a raw material for making copper clad laminates (CCL), have hiked 5% in November 2010 to reflect rising copper costs, according to industry sources. Meanwhile,...
Monday 1 November 2010
ASE plans for 2011 capex of US$700-800 million
Advanced Semiconductor Engineering (ASE) plans to budget US$700-800 million for 2011, similar to its 2010 budget according to the company. The packaging and testing firm also said...
Wednesday 20 October 2010
CCL maker Iteq reports self-evaluated 3Q10 results
Copper clad laminate (CCL) maker Iteq has reported third-quarter revenues of NT$5.36 billion (US$173.69 billion), down 5% sequentially. Pre-tax profit fell to NT$497 million or NT$5.75...
Monday 18 October 2010
Co-Tech expecting copper foil shipments decline in 4Q10
Co-Tech Copper Foil expects its revenues to be lower than expected in the fourth quarter of 2010 due to a decline in shipments of its copper foils in October and unclear order visibility...
Wednesday 13 October 2010
Taiwan component makers under pressure of increased costs due to rising copper prices
As London Metal Exchange (LME) quotes for copper have risen to US$8,290/ton, the highest since July 2008, plus labor costs in China are rising, Taiwan-based makers of electronic connectors...
Wednesday 13 October 2010
CCL makers 4Q10 profit to fall due to copper foil price hike and weak high-season demand
Copper clad laminate (CCL) makers could see fourth-quarter 2010 profits contract due to an increase in copper foil quotes, which rose 3-5% in September and another 5% in October....
Tuesday 12 October 2010
ASE and SPIL likely to see 1Q11 profits halve, says paper
Major chip packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are likely to see their profits for the first quarter of 2011 halve from...
Tuesday 5 October 2010
IC back-end firms 4Q10 gross margins likely hurt by strong NT dollar, rising material costs
Soaring gold and copper prices, as well as losses resulting from the appreciation of the NT dollar, are likely to affect packaging and testing firms' gross margins in the fourth quarter...