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NEWS TAGGED COPPER
Thursday 28 January 2010
Survey highlights more IC suppliers consider switch to copper wire, says SEMI
An increasing number of fabless chip companies and IDMs are considering copper wire for some new products, though a number of issues exist regarding this transition, according to...
Thursday 14 January 2010
Power cord maker Taiwan Line Tek sees gross margin impacted by rising copper prices
Power cord maker Taiwan Line Tek Electronic has said it plans to transfer some of its rising costs, caused by a surge in global copper prices, onto its clients in order to maintain...
Tuesday 12 January 2010
PCB material prices to rise
Some PCB material suppliers have raised their prices while others are likely to follow suit soon, which is expected to impact PCB makers' profits in the first quarter of 2010, according...
Wednesday 6 January 2010
CCL prices to rise after Lunar New Year
The price of copper-clad laminates (CCLs) is likely to be raised after the Lunar New Year holidays as the average copper price has exceeded US$7,300 per ton and PCB demand remains...
Thursday 3 December 2009
Surging copper price to impact PCB supply chain
Copper foil and copper-clad laminates (CCL) makers' profits in the fourth quarter of 2009 will be eroded since the average copper price per ton has topped US$7000, compared to US$6100-US$6700...
Wednesday 25 November 2009
STATS ChipPAC moves copper wire bonding process to volume production
STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).
Monday 2 November 2009
ASE, SPIL speeding up copper wire bonding expansion
Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...
Thursday 29 October 2009
SPIL says 2010 capex to double
Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...
Friday 16 October 2009
ASE and SPIL deny headhunting rumors
Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...
Thursday 8 October 2009
ASE 3Q09 gross margin expected to grow on more IDM outsourcing
Advanced Semiconductor Engineering (ASE) is estimated to see its gross margin climb 3.3pp sequentially to 25% in the third quarter of 2009, in line with better revenue growth, according...
Thursday 1 October 2009
ASE ramping copper wire bonding output
Advanced Semiconductor Engineering (ASE) has been ramping up its output utilizing a copper wire bonding process, with shipments of such ICs reaching over 50 million units in the past...
Tuesday 15 September 2009
NPC hikes CCL quotes
Nan Ya Printed Circuit Board (NPC) has raised its prices of copper-clad laminates (CCLs) to reflect the increased average copper price, according to industry sources.
Friday 11 September 2009
CCL maker EMC raises product price by 10%
Elite Material (EMC) has announced a 10% rise of copper-clad laminate (CCL) ASP for September to reflect increased copper prices. The average copper price has reached US$6,500 per...
Monday 7 September 2009
Notebook power cord quotes to rise along with copper pricing in 2H09, says paper
The price of notebook power cords is expected to rise 5-10% in the second half of 2009 as global copper prices continues to increase, according to a Chinese-language Commercial...
Wednesday 19 August 2009
FCCL maker Thinflex draws strategic investment from Arisawa
Thinflex, a Taiwan-based maker of flexible copper clad laminates (FCCLs), has announced that Arisawa Manufacturing is looking to become its largest shareholder. The Japan-based material...