Copper-clad laminate (CCL) quotes are likely to rise in March 2010 to reflect the rising price of copper, according to industry sources. The average copper price has topped US$7,400...
Taiwan Semiconductor Manufacturing Company (TSMC) has announced separate equipment purchases totaling around NT$3.85 billion (US$120 million) from Lam Research, Tokyo Electron, ASML,...
With Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) aggressively ramping production on copper-wire bond processes, second-tier Taiwan-based IC...
The global IC packaging and testing industry is expected to grow by a double-digit rate in 2010, according to Bough Lin, chairman of Siliconware Precision Industries (SPIL). In line...
An increasing number of fabless chip companies and IDMs are considering copper wire for some new products, though a number of issues exist regarding this transition, according to...
Power cord maker Taiwan Line Tek Electronic has said it plans to transfer some of its rising costs, caused by a surge in global copper prices, onto its clients in order to maintain...
Some PCB material suppliers have raised their prices while others are likely to follow suit soon, which is expected to impact PCB makers' profits in the first quarter of 2010, according...
The price of copper-clad laminates (CCLs) is likely to be raised after the Lunar New Year holidays as the average copper price has exceeded US$7,300 per ton and PCB demand remains...
Copper foil and copper-clad laminates (CCL) makers' profits in the fourth quarter of 2009 will be eroded since the average copper price per ton has topped US$7000, compared to US$6100-US$6700...
STATS ChipPAC has ramped production on its copper wire bonding process, joining rivals Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL).
Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper...
Siliconware Precision Industries (SPIL) has set its capex budget for 2010 at NT$10 billion (US$307.7 million), doubling from NT$5.3 billion allocated for 2009, according to company...
Taiwan-based chip packaging houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both come out to deny a Citi Investment Research report...
Advanced Semiconductor Engineering (ASE) is estimated to see its gross margin climb 3.3pp sequentially to 25% in the third quarter of 2009, in line with better revenue growth, according...
