Co-Tech is developing copper foils used in lithium batteries for electric cars, with samples expected to deliver later in the second quarter, according to company chairman Chung-Hsiung...
Taiwan-based makers of PC cables, power supplies and cooling modules have upwardly adjusted quotes to notebook makers to reflect increased material cost as the international copper...
Chip packaging and testing company Advanced Semiconductor Engineering (ASE) expects shipments to grow by 11-13% sequentially in the second quarter of 2010, driven particularly by...
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has announced net profits of NT$3.395 billion (US$108 million) on consolidated revenues of NT$37.555 billion...
Chip packaging and testing house Siliconware Precision Industries (SPIL) saw net profits for the first quarter of 2010 decline 60% sequentially to NT$1.51 billion (US$48.31 million)...
The long awaited transition to copper interconnects for memory devices skyrocketed in 2009, and will impact nearly every sector of the semiconductor equipment market into 2011, according...
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has reported consolidated revenues for the first quarter rose 42.8% sequentially to NT$37.56 billion. Meanwhile,...
Makers of notebook power supplies and cooling modules are preparing to increase their quotes as the rising labor costs in China as well as increasing copper prices are impacting their...
Copper foil supplier Co-Tech is running at high utilization rates and has received orders for April 2010. The company said it may raise quotes for copper foil in March. The average...
Shuen Der Industry (SDI) has announced it plans to draw investment via private placement from Mitsubishi Shindoh, which produces copper strips for leadframes. The leadframe maker...
Copper-clad laminate (CCL) quotes are likely to rise in March 2010 to reflect the rising price of copper, according to industry sources. The average copper price has topped US$7,400...
Taiwan Semiconductor Manufacturing Company (TSMC) has announced separate equipment purchases totaling around NT$3.85 billion (US$120 million) from Lam Research, Tokyo Electron, ASML,...
With Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) aggressively ramping production on copper-wire bond processes, second-tier Taiwan-based IC...
The global IC packaging and testing industry is expected to grow by a double-digit rate in 2010, according to Bough Lin, chairman of Siliconware Precision Industries (SPIL). In line...
