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Monday 31 January 2011
ASE sees flat growth in 1Q11 sales
Advanced Semiconductor Engineering (ASE) expects to see revenues generated from its core ATM (assembly test and material) business stay flat sequentially in the first quarter of 2011,...
Friday 28 January 2011
ASE 4Q10 net profits up 44%; full-year profits soar
Advanced Semiconductor Engineering (ASE) has announced net profits for the fourth quarter of 2010 climbed 43.8% on year to NT$4.96 billion (US$171 million). Net profits for the whole...
Thursday 27 January 2011
SPIL 4Q10 gross margin up on higher copper wire bonding sales
Siliconware Precision Industries (SPIL) saw its gross margin increase to reach 14.3% in the fourth quarter of 2010, up 0.1pp sequentially and beating market estimates. The chip packager...
Thursday 20 January 2011
Second-tier IC packagers lower quotes to woo orders from IC designers
Second-tier IC packaging and testing companies have lowered their quotes by 5-10% on average recently in order to attract more orders from IC design houses who have been switching...
Monday 17 January 2011
ASE raises capex for 2011, says paper
Advanced Semiconductor Engineering (ASE) has internally raised its capex budget to US$900 million for 2011 from the US$700 million estimated originally, according to a Chinese-language...
Thursday 6 January 2011
Co-Tech posts 16% sequential growth in December revenues
Copper foil maker Co-Tech saw December 2010 revenues climb 16% sequentially to NT$470 million (US$16 million), as clients began to build up inventory in anticipation of higher copper...
Friday 31 December 2010
PCB material prices on the rise
Prices for fiber glass yarns and fabrics, key materials for making copper clad laminates (CCL), are set to rise by as much as 15% in January 2011, according to industry sources. The...
Wednesday 29 December 2010
Copper foil prices set to continue rising
Prices for copper foil, the raw material of copper clad laminates (CCL), will go up by 5-7% in January 2011, according to industry sources. Prices already grew 5% in December.
Wednesday 22 December 2010
Co-Tech lowers copper foil quotes by 5% in December 2010
With copper prices continuing to trend up, copper foil quotes have increased 5% in December 2010, according to copper foil maker Co-Tech. Copper foil quotes from November 21 to December...
Thursday 16 December 2010
STATS ChipPAC, Intersil qualify copper wire interconnect for analog and mixed-signal devices
STATS ChipPAC and Intersil have qualified the use of copper wire interconnect solutions on a number of high-end analog and mixed-signal devices which are in volume production, STATS...
Friday 10 December 2010
Copper foil prices up another 5%
Quotes for copper foil have risen for the fourth consecutive month, up by 5% in December 2010 compared with November, according to industry sources. The upward trend reflects strengthening...
Wednesday 8 December 2010
Gold price increase spurs adoption of copper-wire bonding
With gold futures climbing to an historical high and copper prices relatively stable, IC packaging houses could see their gross margins eroded. The price difference between gold-wire...
Wednesday 24 November 2010
ASE grabs copper wirebonding orders from second-tier players
With Silicon Precision Industries (SPIL) quickly catching up with Advanced Semiconductor Engineering (ASE) in copper wirebonding, ASE is currently attempting to win orders over second-tier...
Tuesday 9 November 2010
CCL makers post mixed results for October
CCL (copper clad laminate) maker Iteq has registered NT$1.67 billion (US$55.3 million) in October consolidated revenues, up 1.8% from September. Fellow company Elite Materials (EMC)...
Friday 5 November 2010
Co-Tech October revenues down 11.5% on-month
Copper foil maker Co-Tech has posted revenues of NT$478 million (US$15.8 million) for October 2010, down 11.5% sequentially. But revenues were up 30% from a year ago.
Next-Gen Retail Revolution: The Power of Edge AI and Cloud Surveillance
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research