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NEWS TAGGED COPPER
Friday 22 April 2011
Glass fabric price rally to slow in May
Prices for fiber glass fabrics in May 2011 will rise at a slower rate compared to 5-10% increases in April as producers of copper clad laminates (CCL) have been reluctant to place...
Friday 8 April 2011
Glass fabric prices to rise 5-10% in April
Prices for fiber glass fabrics, which are used for making copper clad laminates (CCL), are set to increase by 5-10% in April 2011, according to industry sources. Mainstream 7628-size...
Friday 4 March 2011
SPIL sees boost in copper wirebonding orders, says paper
With more fabless IC firms adopting copper wire to package their products for cost reasons, packaging and testing house Siliconware Precision Industries (SPIL) has seen a substantial...
Thursday 3 March 2011
Chipbond, KYEC team up for power IC packaging and testing
LCD driver-IC packaging and testing firm Chipbond Technology and King Yuan Electronics (KYEC), which specializes in chip probing and final test services, have signed a memorandum...
Tuesday 22 February 2011
Copper foil prices to continue to rally in March, says paper
Prices for copper foil, a raw material for making copper clad laminates (CCL), will be adjusted upward again in March, the Chinese-language Commercial Times cited industry...
Tuesday 15 February 2011
High copper price damaging profitability of notebook component makers
Taiwan-based makers of notebook components such as connector, cable, power supply and cooling modules are seeing their profitability drop as the recent global copper price is hovering...
Tuesday 1 February 2011
Rising copper price to trigger competition for securing component supply
As London Metal Exchange (LME) spot quotes for copper are expected to steadily climb to a new record level of nearly US$10,000 per metric ton after the Lunar New Year, sources from...
Monday 31 January 2011
ASE sees flat growth in 1Q11 sales
Advanced Semiconductor Engineering (ASE) expects to see revenues generated from its core ATM (assembly test and material) business stay flat sequentially in the first quarter of 2011,...
Friday 28 January 2011
ASE 4Q10 net profits up 44%; full-year profits soar
Advanced Semiconductor Engineering (ASE) has announced net profits for the fourth quarter of 2010 climbed 43.8% on year to NT$4.96 billion (US$171 million). Net profits for the whole...
Thursday 27 January 2011
SPIL 4Q10 gross margin up on higher copper wire bonding sales
Siliconware Precision Industries (SPIL) saw its gross margin increase to reach 14.3% in the fourth quarter of 2010, up 0.1pp sequentially and beating market estimates. The chip packager...
Thursday 20 January 2011
Second-tier IC packagers lower quotes to woo orders from IC designers
Second-tier IC packaging and testing companies have lowered their quotes by 5-10% on average recently in order to attract more orders from IC design houses who have been switching...
Monday 17 January 2011
ASE raises capex for 2011, says paper
Advanced Semiconductor Engineering (ASE) has internally raised its capex budget to US$900 million for 2011 from the US$700 million estimated originally, according to a Chinese-language...
Thursday 6 January 2011
Co-Tech posts 16% sequential growth in December revenues
Copper foil maker Co-Tech saw December 2010 revenues climb 16% sequentially to NT$470 million (US$16 million), as clients began to build up inventory in anticipation of higher copper...
Friday 31 December 2010
PCB material prices on the rise
Prices for fiber glass yarns and fabrics, key materials for making copper clad laminates (CCL), are set to rise by as much as 15% in January 2011, according to industry sources. The...
Wednesday 29 December 2010
Copper foil prices set to continue rising
Prices for copper foil, the raw material of copper clad laminates (CCL), will go up by 5-7% in January 2011, according to industry sources. Prices already grew 5% in December.