Prices of copper foil and copper clad laminates (CCLs) are expected to drift lower in July 2010 due to a decline in copper prices on the international market, according to industry...
Chip packaging house Siliconware Precision Industries (SPIL) will raise 2010 capex budget by at least 30% from US$450 million to about US$585 million due to increased procurement...
Advanced Semiconductor Engineering (ASE) has decided to boost its 2010 capex to US$600-700 million from US$450-500 million it earlier planned, said company COO Tien Wu at a recent...
Most Taiwan-based CCL (copper clad laminate) makers, including Elite Materials (EMC), Nanya Plastics, Taiwan Union Technology (TUC) and Iteq, are running at full capacity at the moment...
Higher gold prices have prompted chip packaging houses to consider transferring rising material costs to customers. Advanced Semiconductor Engineering (ASE) started adjusting quotes...
Prices for copper foil, the raw material of copper clad laminates (CCL), are likely to drop 3-4% in June due to recent weakening copper prices, according to industry sources in Tai...
United Test and Assembly Center (UTAC) has seen sales generated from copper wire bonding account for 20% of its total revenues, according to company CEO Lee Joon Chung. Apart from...
Taiwan-based Co-Tech Copper Foil expects its sales of copper foil to top 15,000 metric tons in 2010, increasing 25% from the 12,000 tons shipped in 2009, according to company chairman...
Co-Tech is developing copper foils used in lithium batteries for electric cars, with samples expected to deliver later in the second quarter, according to company chairman Chung-Hsiung...
Taiwan-based makers of PC cables, power supplies and cooling modules have upwardly adjusted quotes to notebook makers to reflect increased material cost as the international copper...
Chip packaging and testing company Advanced Semiconductor Engineering (ASE) expects shipments to grow by 11-13% sequentially in the second quarter of 2010, driven particularly by...
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has announced net profits of NT$3.395 billion (US$108 million) on consolidated revenues of NT$37.555 billion...
Chip packaging and testing house Siliconware Precision Industries (SPIL) saw net profits for the first quarter of 2010 decline 60% sequentially to NT$1.51 billion (US$48.31 million)...
The long awaited transition to copper interconnects for memory devices skyrocketed in 2009, and will impact nearly every sector of the semiconductor equipment market into 2011, according...
Chip packaging and testing house Advanced Semiconductor Engineering (ASE) has reported consolidated revenues for the first quarter rose 42.8% sequentially to NT$37.56 billion. Meanwhile,...
