Copper foil maker Co-Tech has posted revenues of NT$478 million (US$15.8 million) for October 2010, down 11.5% sequentially. But revenues were up 30% from a year ago.
Prices for copper foil, a raw material for making copper clad laminates (CCL), have hiked 5% in November 2010 to reflect rising copper costs, according to industry sources. Meanwhile,...
Advanced Semiconductor Engineering (ASE) plans to budget US$700-800 million for 2011, similar to its 2010 budget according to the company. The packaging and testing firm also said...
Copper clad laminate (CCL) maker Iteq has reported third-quarter revenues of NT$5.36 billion (US$173.69 billion), down 5% sequentially. Pre-tax profit fell to NT$497 million or NT$5.75...
Co-Tech Copper Foil expects its revenues to be lower than expected in the fourth quarter of 2010 due to a decline in shipments of its copper foils in October and unclear order visibility...
As London Metal Exchange (LME) quotes for copper have risen to US$8,290/ton, the highest since July 2008, plus labor costs in China are rising, Taiwan-based makers of electronic connectors...
Copper clad laminate (CCL) makers could see fourth-quarter 2010 profits contract due to an increase in copper foil quotes, which rose 3-5% in September and another 5% in October....
Major chip packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are likely to see their profits for the first quarter of 2011 halve from...
Soaring gold and copper prices, as well as losses resulting from the appreciation of the NT dollar, are likely to affect packaging and testing firms' gross margins in the fourth quarter...
IC packaging and testing house Advanced Semiconductor Engineering (ASE) plans to budget US$700 million in capex for 2011, flat on year, an unnamed company executive has been cited...
Supply of copper foils will likely fall short of demand in 2011 and 2012, being constrained by major makers' relatively conservative expansion plans, according to Tony Ke, president...
Taiwan-based Co-Tech Copper Foil expects its production of thin copper foils of below 0.5 oz will account for 62% of its total output in October 2010 compared to 57-58% currently.
Advanced Semiconductor Engineering (ASE) is slowing down the expansion of its copper wirebonding capacity due to low market visibility, according to a Chinese-language Economic...
Chip packaging and testing house Greatek Electronics, which mainly focuses on the consumer electronics segment, expects monthly revenues to top NT$10 billion (US$314 million) between...
Siliconware Precision Industries (SPIL) has revealed that another 600 copper wirebonders will be installed at its production sites in China and Taiwan during the third quarter. Total...
