Aveni, a developer and manufacturer of wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, has announced it has obtained results...
Semiconductor material distributor Wahlee Industrial has obtained dry-film photoresist orders from Taiwan-based PCB firms for the production of substrate-like PCBs (SLP), according...
Rising copper foil prices continued to buoy Co-Tech Copper Foil's profitability in the second quarter of 2017, which hit a record high for the fourth consecutive quarter.
Credo Semiconductor, a developer of serializer-deserializer (SerDes) circuits, technology and IP cores, and Foxconn Interconnect Technology, a supplier of interconnect solutions,...
Taiwan-based Faraday Technology has announced an automotive ASIC device qualified for AEC-Q100 and AEC-Q006 as defined by the Automotive Electronics Council (AEC).
Co-Tech Copper Foil has reported net profits of NT$347 million (US$11.41 million) for the first quarter of 2017, increasing 19.33% on quarter and 556.86% on year. The earnings translated...
Co-Tech Copper Foil is expected to post sequential revenue growth in the first quarter of 2017, as supply of copper foil is tight, according to industry sources.
Co-Tech Copper Foil has reported consolidated revenues of NT$520 million (US$16.37 million) for November, increasing 2.56% sequentially and 39.31% on year. Accumulated 2016 revenues...
While copper wire is considered a cheaper alternative to gold wire for ball wire bonding used in semiconductor packaging, a process based on aluminum wire has been developed by Taiwan's...
While fiber-optic networks are increasingly replacing copper-wired networks, they are unlikely to completely replace copper in 10 years, according to chairman John Lee for networking/communication...
Copper foil maker Co-Tech Copper Foil has reported consolidated revenues of NT$366 million (US$11.2 million) for February 2016, up 14.3% on year. Revenues for the first two months...
Flexible copper clad-laminate (FCCL) maker Asia Electronic Materials (AEM) has reported revenues of NT$119 million (US$3.8 million) for June 2015, up 4.15% on month but down 26.15%...
The global IC packaging and testing industry has been working through excessive inventory for almost two quarters, but is set for tepid growth in the second half of the year, according...
Applied Materials has announced its Applied Endura Cirrus HTX PVD (physical vapor deposition) system with breakthrough technology for patterning copper interconnects at 10nm and beyond...
