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Wednesday 29 July 2020
Semiconductor packaging materials to see 3.4% CAGR during 2019-2024
The global semiconductor packaging materials market will expand from US$17.6 billion in revenue logged in 2019 to US$20.8 billion in 2024, a 3.4% compound annual growth rate (CAGR),...
Thursday 16 July 2020
Co-Tech enjoys strong copper foil shipments for high-speed CCLs
Co-Tech Copper Foil, which produces copper foil used to manufacture CCLs and PCBs, has enjoyed strong shipments for high-frequency and high-speed CCLs needed to support 5G and AI...
Wednesday 8 July 2020
CCL maker Iteq to maximize output at new China plant in August
Copper clad laminate (CCL) specialist Iteq will ramp up output at its new plant in in Jiangxi, China seeking to achieve full capacity utilization in August to meet strong demand...
Wednesday 6 May 2020
CCL maker Iteq to see 5G infrastructure drive 2H20 sales
Copper clad laminate (CCL) specialist Iteq stays positive about its business prospect for the second half of 2020, as demand for 5G and data center applications will surge further...
Thursday 23 April 2020
Eternal sees robust orders for dry-firm photoresist
Taiwan-based Eternal Materials currently sees full utilization of its dry-film photoresist production capacity, while that of its paper phenolic copper clad laminate is at between...
Wednesday 18 December 2019
China CCL firms to raise quotes
China-based CCL suppliers, including Kingboard Copper Foil and Shengyi Technology (Sytech), have announced plans to raise quotes for part of their products. Their fellow Taiwan-based...
Thursday 21 November 2019
Leadframe maker Jih Lin looks to return to growth track in 2020
Taiwan-based leadframe maker Jih Lin Technology expects its revenues to resume growth in 2020 on renewed demand for diverse leadframes from international IDMs for packaging automotive...
Thursday 17 October 2019
TUC reportedly suffers from faulty CCL
Copper clad laminate (CCL) maker Taiwan Union Technology (TUC) has reportedly encountered some quality issues that may lead to loss of some major orders from Google, according to...
Wednesday 31 July 2019
JCET kicks off 12-inch wafer bumping production in S Korea
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based IC backend service provider, has announced that volume production is kicking off at its new 12-inch wafer...
Friday 8 March 2019
FCCL makers keen to develop new material solutions for 5G
Taiwan makers of flexible copper clad laminate (FCCL) and coverlay, materials for flexible PCBs, are gearing up to develop new material solutions and build new production lines to...
Thursday 21 February 2019
Taiflex sees revenue decline in 2018, but keeps gross margin at above 20%
Taiwan-based Taiflex Scientific has announced financial results for the fourth quarter of 2018 and the whole year 2018. The company saw its 2018 consolidated revenues drop from a...
Thursday 27 December 2018
Copper foil firm LCY enhances high-end offering for profitability
LCY Technology, which produces and sells copper foil products, will continue to enhance its high-end offering to boost profitability, according to the company.
Monday 10 December 2018
China leadframe supply chain not gaining ground, says Chang Wah chairman
Chances are not high for leadframe suppliers to score double-digit revenue increases in 2019, and China leadframe supply chain can hardly emerge to threaten Taiwan peers, according...
Thursday 6 December 2018
CCL firm Ventec approved for listing on TWSE mainboard
The Taiwan Stock Exchange (TWSE) has approved the listing application of copper clad laminate (CCL) supplier Ventec International, which expects to start trading on the TWSE mainboard...
Wednesday 24 October 2018
Taiflex net profits fall 15% in 3Q18
Taiwan-based Taiflex Scientific, which supplies flexible copper-clad laminates (FCCL) and PV module backsheets, has reported net profits for the third quarter of 2018 fell 15.2% on...
TPCA
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research