The upcoming availability of new-generation GPUs will be stimulating the do-it-yourself PC market particularly the gaming PC segment in the second half of 2021, according to industry...
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Taiwan ABF substrate makers have been running their production lines at full capacity, with new orders unlikely to be fulfilled until 2023, according to industry sources.
The global supply of IC substrates will not see major inprovement until late 2021 or 2022 when Taiwan-based suppliers' additional capacity comes online, according to industry sourc...
Nan Ya Printed Circuit Board has disclosed plans to invest a total of NT$8 billion (US$286.4 million) to expand production capacity for ABF substrates at its factory site in Shulin,...
The supply of BT substrates has been increasingly tight, as more vendors of chips, particularly cryptomining ASICs, have turned to adopt BT substrates amid worsening shortages of...
Apple has announced a new iPad Pro equipped with in-house-designed M1 chip and a 12.9-inch Liquid Retina XDR display, and has also unveiled an 11-inch model.
Demand for flip-chip (FC) packaging particularly FC-BGA will be rising significantly driven by the HPC device market boom this year, and backend houses in Taiwan and China have seen...
Nvidia CEO Jensen Huang has unveiled the company's latest innovations covering autonomous machines, AIs, chips, supercomputers and software during his presentation at GTC 2021.
TSMC's bold US$100 billion capex plan for the next three years has greatly boosted the confidence of its ecosystem partners about bright prospects for the semiconductor industry,...
Testing houses including Sigurd Microelectronics and King Yuan Electronics have already seen their capacity fall short of demand since the start of the second quarter, driven by strong...
Dell, eyeing the potential of liquid cooling for servers, has developed a technology to detect leakage of liquid cooling modules, according to Eric Leung, director of Enterprise Solution...
IC backend houses are expected to run their mainstream wire-bonding packaging lines at full capacity through the end of the year to meet strong demand for automotive and consumer...
