Taiwan's suppliers of MOSFET chips and ESD (electrostatic discharge) protection devices, after ending the second quarter of 2020 with impressive revenue increases, are expected to...
Taiwan-based IC substrate suppliers Unimicron Technology, Nan Ya Printed Circuit Board (NPC) and Kinsus Interconnect Technology all ended the first half of 2020 with double-digit...
Following the penetration into the supply chain of Google Cloud's Compute Engine platform, Nvidia has recently obtained more orders for its A100 GPU from the US-based cloud computing...
Taiwan's major CCL makers including Elite Material (EMC), Iteq and Taiwan Union Technology are all moving to expand their capacity for high-frequency, high-speed CCL materials to...
TSMC, after launching 3D SoIC backend service, has also developed InFO_SoW (system-on-wafer) technology mainly for processing supercomputing AI chips and is expected to enter commercial...
Nvidia is currently still ahead of competitors in the server GPU market and saw its revenues from the datacenter business reach US$2.98 billion in 2019, nearly three times those of...
Nan Ya PCB will be striving to boost its profits in 2020 by focusing more on shipments of high-value products such as ABF and SiP substrates, according to company chairman CC Wu.
With power consumption of servers rising due to increased CPU and GPU performances, traditional air cooling solutions are becoming less efficient in heat dissipation, prompting more...
Supply chain partners of AMD, Nvidia and Intel have been left confused recently by the chip vendors' product launch schedules, which have either been changed frequently or kept a...
ABF substrate supply shortfalls are likely to widen further into 2021 as demand for 5G infrastructure, networking and high-end GPU and CPU applications has outgrown capacity expansions...
TSMC's 5nm technology will be offered in more process variants, including a further enhanced 5nm node in addition to 5nm Plus, according to sources at IC inspection services companies...
Taiwan-based IC substrate makers including Unimicron Technology and Na Ya PCB are gearing up to strengthen business ties with US clients seeking to offset expected losses of orders...
Backend IC packaging and testing service providers will begin shipments of the customized SoCs designed by AMD specifically for PlayStation 5 (PS5) to their downstream partners in...
Networking devices, in addition to servers, will be driving the ABF substrate market growth in the second half of 2020 bolstered by growing demand to support remote activities, according...
Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from...
